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Lead and coordinate multiple New Product Introduction (NPI) projects from concept through volume production. Own project planning, scheduling, risk management, and cross-functional alignment across engineering, manufacturing, quality, and supply chain. Provide EBR planning, visibility, phase‑gate readiness support, and management reporting to ensure on‑time, on‑target delivery and continuous improvement.

Lead and coordinate New Product Introduction projects from concept through volume production. Manage project planning, scheduling, risk, and cross-functional alignment across engineering, manufacturing, quality, and supply chain. Provide EBR planning, visibility, reporting, and support phase-gate readiness and continuous improvement.

Lead quality and reliability for new analog, mixed-signal and non-volatile memory products. Define reliability requirements, design accelerated stress tests, run data analysis, coordinate cross-functional teams and customers, drive failure analysis and risk assessments to ensure successful NPD qualification and customer ramp.

Participate in development and maintenance of software applications across design to deployment. Work with PHP, Python, JavaScript/TypeScript and React; optional involvement in CI/CD, Docker, Kubernetes, UI/UX, and Linux infrastructure. Collaborate in a team while also working independently on frontend or infrastructure tasks.

Lead transfer, qualification, and ramp-up of new semiconductor products/packages/technologies. Define processes, BOMs, risk mitigations; troubleshoot qualification failures; select materials/equipment; drive yield, cost, stability, and quality improvements; use DOE, SIPOC and Lean Six Sigma to implement manufacturable solutions.

Manage strategic global customer accounts: develop and execute sales business plans, coordinate global sales and engineering support, drive design wins with FAE and BUs, provide forecasts, competitive analysis, and build executive-level customer relationships to grow revenue and market share.

Perform failure analyses on new-product, qualification, design-debug and customer-return failures across image sensors, ASICs, analog/mixed-signal and digital devices. Isolate failure mechanisms, analyze test logs and imaging, run bench characterization, apply PEM/OBIRCH and CAD review, and direct material/physical analyses (SEM, FIB, TEM, EDS, Auger, FTIR, SIMS). Document findings and link failure mechanism to failure mode as part of 8D problem solving.

The role involves leading new product development in test engineering for semiconductor devices, focusing on Analog/Digital DfT, test strategies, and ATE platforms.

Manage and coordinate multiple New Product Introduction (NPI) projects, ensuring timely execution and compliance. Lead project planning and cross-functional coordination.

Lead functional design, configure and extend Oracle Cloud Logistics (WMS, OTM, GTM). Gather requirements, produce BR100/MD50 documents, support testing (CRP/SIT/UAT), troubleshoot with SQL and Oracle Support, and liaise on integrations (OIC, EDI, XML, SOA).