Top Tech Jobs & Startup Jobs

Develop and implement ATE test plans and hardware for mixed-signal power-management ICs. Characterize and debug silicon on ATE and bench, analyze yield and failure data, optimize test time, support production release, and drive cost-effective, robust test solutions for DCDC converter products.

Participate in an 8-month rotational FAST program in technical sales, gaining field sales, mass-market scaling, and business unit/SEM experience, plus a four-week headquarters immersion. Build customer relationships, identify and manage sales opportunities, forecast revenue, and transition into a Technical Sales Representative role on completion.

The role involves executing physical design flows, performing synthesis, floor-planning, timing closure, power optimization, and verification for ASIC/SoC blocks in audio applications.

Architect mixed-signal microcontroller systems, defining system architecture and specifications, leading cross-functional innovation efforts, and collaborating with diverse engineering teams.

Maintain, optimize, and support semiconductor manufacturing equipment. Lead installations, upgrades, preventative maintenance, vendor engagement, data-driven performance improvements, and projects to increase uptime and tool efficiency.

Design, integrate, and validate Complex Device Drivers (CDDs) for Battery Management Systems into AUTOSAR BSW. Collaborate with customers and cross-functional teams to define requirements, lead debugging and performance optimization, ensure ISO26262 and ASPICE compliance, and produce documentation and deliverables.

Perform electrical failure analysis on semiconductor devices: collect and analyze debug and scan test data, use ATPG and memory-mapping tools to identify failure signatures, bench-test with production/custom patterns to isolate failing circuitry, and correlate electrical signatures with physical defects working cross-functionally with test, design, and PFA labs.

Lead software quality efforts for functional safety: develop and execute test plans, audit per Automotive SPICE/ISO 26262/ISO21434, define metrics, drive process and tooling adoption, support OEM/customer quality and cybersecurity discussions, and provide technical leadership to improve product quality.

Manage full semiconductor molding (epoxy encapsulation) process: parameter optimization, production maintenance, defect reduction (overflow, voids, delamination, warpage, cracking), material validation, curing optimization, appearance and electrical consistency control, document SOPs and improve process capability, and support new product molding trials.

Design and verify analog I/O circuits (GPIOs, level shifters, LVDS, bandgaps, LDOs), run PVT and Monte Carlo simulations, perform post-layout simulations, analyze verification data, generate dotlibs/IBIS, and collaborate cross-functionally for SoC integration.