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Lead global, cross-functional teams through semiconductor new-product development from opportunity assessment to market release. Manage schedules, budgets, quality, materials logistics, qualification plans, reliability characterization, failure analysis, manufacturing coordination, customer milestones, and executive reporting. The role drives flawless execution, product launches, and forecasted return on investment across design, fabrication, assembly, testing, and production ramp activities.

Leads full-chip analog and mixed-signal IC layout from planning through production release. Responsibilities include scheduling, estimation, risk mitigation, layout optimization, design-rule and PDK updates, packaging collaboration, parasitic and reliability analysis, test-vehicle development, final verification, process improvement, and mentoring junior engineers.

Coordinates vendors, procurement, inventory, logistics, testing, qualification plans, manufacturing setup, product releases, data collection, and customer returns. Ensures prototype builds, manufacturing flows, quality standards, reporting, and product engineering best practices meet project requirements.

Support introduction and development of new semiconductor processes and test platforms. Provide technical support during product production/testing, collaborate with design, process, equipment, reliability and manufacturing teams to resolve issues, and develop, maintain and improve manufacturing processes to reduce costs and improve yield.

The role involves designing ESD protection structures, performing ESD reviews, troubleshooting failures, and maintaining design libraries and guidelines for analog products.

The Applications Engineer will support design-in activities, provide technical support, collaborate with various teams and engage with CPU vendors for new product development in power solutions.

The Applications Engineer supports and develops high speed amplifier products through customer application support, design reviews, debugging, and creating user documentation. Responsibilities include schematic reviews, bench characterization, and creating reference designs for customer use.

负责新产品测试开发、产能与成本优化，支持产品线盈利，协调供应链、制造、质量及客户支持，解决客户质量与应用问题，并推动跨职能团队与晶圆/封装厂沟通与问题解决。

Lead data-driven defect-limited yield analysis across analog and mixed-signal products. Triage defect excursions, perform root-cause analysis, define inspection sampling, build predictive yield models correlating defect density with electrical test results, and partner across Process, Product, Integration, Equipment, and Quality teams to implement corrective actions and virtual metrology.

Design, deploy, and operate secure cloud environments (AWS GovCloud/Azure Government), implement IaC and automation, apply STIGs/CIS benchmarks, ensure compliance with NIST/FedRAMP/DoD regulations, monitor threats, support incident response, and provide cloud security guidance across teams.