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3 Days AgoSaved
In-Office
Bengaluru, Bengaluru Urban, Karnataka, IND
Junior
Junior
Artificial Intelligence • Hardware • Wearables • Semiconductor
Own the silicon security product vision, roadmap, requirements, and execution from concept through production. Define hardware and firmware security features, IP protection, personalization, key injection, licensing, and traceability strategies. Coordinate engineering, business, legal, sales, and customer teams while managing early-access programs, adoption metrics, pricing, positioning, and go-to-market activities.
Top Skills: AnalogAttestationConfluenceDesign VerificationDftEdaEfuseFirmwareGitJIRAJtagOtpPufRtlSecure BootSocSQLVlsi
Reposted 3 Days AgoSaved
In-Office
West Lafayette, IN, USA
115K-150K Annually
Senior level
115K-150K Annually
Senior level
Artificial Intelligence • Hardware • Wearables • Semiconductor
Lead bare-metal bring-up of Wi-R SoCs and Cortex-M/RISC-V platforms, develop and optimize ultra-low-power firmware stacks (I2C, SPI, BLE, DMA, sensor drivers), deliver a production-ready firmware SDK, debug at register level using oscilloscopes and JTAG, mentor junior engineers, and drive toolchain and quality standards across teams.
Top Skills: Bare-Metal Embedded CBleCC++Cortex-MDmaI2CJtagMcuOscilloscopeRisc-VSensor DriversSpiWi-R
Reposted 3 Days AgoSaved
In-Office
Bengaluru, Bengaluru Urban, Karnataka, IND
Mid level
Mid level
Artificial Intelligence • Hardware • Wearables • Semiconductor
Perform RTL integration of IPs and subsystems into top-level SoCs, develop RTL wrappers, interconnect, clock/reset infrastructures; run lint/CDC/early synthesis checks; debug simulation and synthesis issues; automate and maintain integration flows with Python/Perl/Tcl; collaborate with design, verification, and physical design teams and contribute to design reviews and documentation.
Top Skills: AhbApbAxiCdcCpfEda AutomationLintPerlPythonSpyglassSynopsys Design CompilerSystemverilogTclUpfVerilog
Reposted 3 Days AgoSaved
In-Office
West Lafayette, IN, USA
Expert/Leader
Expert/Leader
Artificial Intelligence • Hardware • Wearables • Semiconductor
Lead and grow a world-class IC design organization across analog, mixed-signal, RF, and digital domains. Own end-to-end chip lifecycle from concept through GDSII, tapeout, bring-up and production. Set architecture and technical standards, guide EDA tool and vendor engagements, integrate IP, coordinate with hardware/firmware/product teams, hire and mentor engineers, and represent engineering in executive strategy and partnerships.
Top Skills: Analog Ic DesignAsic DevelopmentDigital Ic DesignEda ToolsFirmwareGdsiiHardware Co-DesignIp IntegrationLow-Power DesignMixed-Signal Ic DesignRf SystemsSoc ArchitectureTapeoutWi-R
Reposted 3 Days AgoSaved
In-Office
Bengaluru, Bengaluru Urban, Karnataka, IND
Senior level
Senior level
Artificial Intelligence • Hardware • Wearables • Semiconductor
Plan and execute end-to-end RTL verification for SoCs and IPs using SystemVerilog and UVM. Build testbenches with functional coverage and assertions, perform gate-level and power-aware verification, debug waveforms, script automation, and collaborate with design, architecture, and system teams to deliver silicon.
Top Skills: AssertionsAxiFunctional CoverageGate-Level SimulationIp VerificationMipiPciePerlPower Extraction ToolsPythonRtlSocSystemverilogTclUvm
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Reposted 3 Days AgoSaved
In-Office
Bengaluru, Bengaluru Urban, Karnataka, IND
Senior level
Senior level
Artificial Intelligence • Hardware • Wearables • Semiconductor
Lead RF/analog/mixed-signal chip tapeouts from design through validation, integrate analog IPs into SoCs, prototype high-speed systems, mentor the team, validate silicon with test automation, and contribute to PCB design and firmware bring-up for wearable devices.
Top Skills: AdsAltiumAnalog Mixed-SignalEagleFirmwareLabviewLtspiceOrcadPcb DesignPythonRf Ic DesignSoc IntegrationTapeout
Reposted 3 Days AgoSaved
In-Office
West Lafayette, IN, USA
160K-190K Annually
Senior level
160K-190K Annually
Senior level
Artificial Intelligence • Hardware • Wearables • Semiconductor
Lead analog and mixed-signal IP design, verification, and integration for Wi-R SoCs. Drive RF IC architecture through post-silicon bring-up, collaborate with firmware/digital/board teams, mentor junior engineers, and publish technical results. Own end-to-end chip development and long-term technical strategy for ultra-low-power wireless silicon.
Top Skills: AdsAltiumEagleLabviewLtspiceOrcadPythonRf Lab ToolsWi-R
Reposted 3 Days AgoSaved
In-Office
Bengaluru, Bengaluru Urban, Karnataka, IND
Senior level
Senior level
Artificial Intelligence • Hardware • Wearables • Semiconductor
Lead RTL micro-architecture and implementation of ultra-low-power communication SoC blocks. Perform RTL linting, simulation, CDC/DRC checks, gate-level simulations, MBIST/DFT integration, ECOs, and power-aware verification using UPF and VCS-NLP. Collaborate with architects, analog teams, and handle timing closure and hardmacro integration.
Top Skills: AsicCdcDftDrcDspEco FlowsGate-Level SimulationHardmacro IntegrationLintingLow-Power DesignMbistPerlPnrPythonSocStaTclUpfVcs-NlpVerilogVhdlWaveform ToolsWireless Communication
Reposted 4 Days AgoSaved
In-Office
Bengaluru, Bengaluru Urban, Karnataka, IND
Junior
Junior
Artificial Intelligence • Hardware • Wearables • Semiconductor
Manage on-site office operations, vendor coordination, procurement, and facilities upkeep. Provide first-line IT support, maintain Wi‑Fi, access control, asset inventory, onboarding/offboarding accounts, and coordinate logistics for shipping, events, and team travel.
Top Skills: Access Control SystemsData BackupEmailIt InfrastructureNetworkingOffice SoftwareWi-Fi
Reposted 14 Days AgoSaved
In-Office
West Lafayette, IN, USA
175K-225K Annually
Expert/Leader
175K-225K Annually
Expert/Leader
Artificial Intelligence • Hardware • Wearables • Semiconductor
Lead architecture and execution of next-generation wearable Wi-R SoCs. Build and manage an IC design team, own RTL-to-GDS tape-outs, drive analog/RF front-end and mixed-signal integration, define verification/IP reuse methodology, and coordinate silicon validation, packaging, and product co-optimization with cross-functional teams.
Top Skills: Analog Ic DesignAsicBluetoothCadenceDftEsdFloorplanningGdsLow-Power Wireless SocsMixed-SignalNfcPackaging Co-DesignRf Front-EndRtl-To-GdsSensor InterfacesSocTiming ClosureUwbWi-R
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