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Hands-on semiconductor process engineer responsible for executing end-to-end cleanroom fabrication of vertical GaN devices. Maintain process documentation and run logs, perform inspections, substrate prep and dicing, coordinate tool scheduling and shift coverage, and contribute to process improvements and exploratory work to reduce cycle time and improve yield.

Work across the full device lifecycle for vertical GaN power devices: architecture, process integration, modeling/simulation, on-wafer and discrete characterization (DC, CV, dynamic), failure analysis, reliability, GDS layout/test structures, and cross-functional collaboration to connect device behavior to system performance.

The Principal Applications Engineer will lead customer technical engagement, develop simulation models, evaluate power converters, and create technical content for Vertical GaN devices.

The Principal Semiconductor Device Engineer leads the development of vertical GaN power devices, focusing on architecture, process integration, modeling, and failure analysis while mentoring junior engineers and collaborating across functions.

Characterize vertical GaN devices on-wafer and in-package using high-voltage instrumentation; design PCB test boards for switching and UIS tests; run JEDEC-style reliability qualifications; automate measurements and analyze data with Python/MATLAB; extract device parameters for datasheets; collaborate cross-functionally to support commercialization.