Top Tech Jobs & Startup Jobs

Serve as the senior HR and talent lead for two Thailand manufacturing sites. Own full-cycle recruiting and talent strategy, workforce planning, onboarding, employee relations, and site HR operations. Partner with site leaders and global People team to build scalable HR processes, improve candidate and manager experience, and support manufacturing, engineering, operations, and quality hiring needs.

Manage and coordinate multiple projects, vendors, and facility needs; maintain trackers, prepare status reports, assist with procurement and invoice reconciliation, and serve as liaison across facilities, engineering, IT, procurement, and external vendors to keep project deliverables on schedule.

Hands-on engineer executing photonics device and PIC characterization, high-speed measurements, and lab test setup. Develops test automation (LabVIEW/Python), supports wafer probing and optical alignment, troubleshoots instrumentation, analyzes data, and aids transition from R&D to early production test flows.

Lead device and PIC characterization and test execution at bench level, architect high-speed measurements, build and scale lab test infrastructure, automate measurement routines, drive root-cause analysis and yield improvements, transition R&D to production test flows, and mentor junior test engineers while collaborating with design, process, and product teams.

Lead and grow a process and manufacturing engineering team for silicon photonics transceivers. Define, prove, and deploy HVM processes, drive continuous improvement, own process documentation and change control, partner with design and contract manufacturers, support qualification testing, champion automation, manage suppliers and capital/equipment selection, and develop staff across global sites.

Lead development, qualification, and supplier management for FR4/PCB substrates (mSAP/Any-Layer HDI). Drive DFM/DFT/DFR, quality control, failure analysis, reliability testing, and support packaging production (SMT, die attach, wire bond, alignment). Interface across design, manufacturing, and global suppliers.

Lead development, qualification, and supplier management for FR4/PCB substrates. Drive DFM/DFT, quality control, failure analysis, reliability testing, and engage in packaging production processes and supplier risk mitigation.

Lead development and support for wafer bumping and fan-out processes for silicon photonic wafers. Design and optimize process flows, qualify materials, run DOE and reliability validations (TCT, HAST, HTS), perform failure analysis with SEM/CSAM, implement SPC and FMEA, and produce SOPs and NPI documentation to improve yield and process stability.

Lead development and optimization of wafer backside grinding, laser stealth dicing, and die sorting for silicon photonics. Troubleshoot process issues, improve yield and throughput, ensure compatibility with bumping/flip-chip, and produce SOPs, WIs, failure reports, and support NPI and process verification.

Lead global sourcing for foundry and OSAT partners: develop supplier strategy, secure wafer/assembly/test capacity, run RFQs and should-cost analysis, negotiate contracts/MSAs, resolve commercial and delivery issues, and align sourcing with engineering and product roadmaps.