At Lumilens, we are building the essential photonics infrastructure that will drive tomorrow’s AI supercomputing. From chip-to-chip optical interconnects to scalable photonic engines, Lumilens is ushering in a new era of computing that is faster, cooler, and dramatically more efficient. We’re a well-funded startup backed by Mayfield and led by veterans who have built and scaled some of the industry’s most transformative technologies.
We are seeking a hands-on DFM Engineer to serve as the primary engineering interface between Lumilens’ hardware design teams, package manufacturing teams and worldwide suppliers.
This role focuses on DFM/DFR of optical transceiver manufacturing process, from SMT,Die Attach, Wire Bonding, Flip Chip, TCB Bonding, Underfill, FAU Active Alignment, Mechanical Assembly, to Reliability Tests. The candidate must have solid hands-on experience in transceiver assembly process, very familiar with various packaging materials and equipment. Strong skills in data review, report summary and communications. Engage with substrate design team, optical design team, chip design team, production line, NPI line and component/material suppliers during early development phase to provide DFM based on different POC designs.
This position is ideal for an engineer who combines deep Material/Chemistry/Mechanical/Electrical/Optical knowledge with a passion for manufacturing process excellence and cross-functional execution at a global scale.
Lead DFM/DFR of various transceiver designs, from pluggable, NPO to CPO.
Capability assessment and risk analysis of each process, machine and material.
Engage with packaging production teams during the early process development,
collect data and make summaries for decision making on time.
B.S. or M.S. in Material, Chemistry or Mechanical Engineering.
10+ years of working experience in transceiver assembly process development or similar products, with in-depth knowledge in material (solder, epoxy, glass, ceramic, etc.), equipment (SMT, die bonder, active aligner, TCB bonding, etc.), component (FR4, PIC chip, EIC chip, FAU, SMD, etc.). Must be very familiar with the typical process capabilities.
Familiar with Cadence, Solidworks and JMP.
Familiar with FMEA, Control Plan, SPC, 8D, etc.
Fluent in English from hearing, writing to speaking.
Benefits
Competitive salary and benefits
Opportunities for career advancement
Work with a world-class team solving cutting-edge challenges
Collaborative and innovative work environment
Lumilens is committed to building a diverse and inclusive workplace. We are proud to be an equal opportunity employer.
Skills Required
- Bachelor’s or master’s degree in Materials, Chemistry, or Mechanical Engineering
- 10+ years of experience in transceiver assembly process development or similar products
- In-depth knowledge of solder, epoxy, glass, ceramic, and other packaging materials
- Experience with SMT, die bonding, active alignment, TCB bonding, and related packaging equipment
- Knowledge of FR4, PIC chips, EIC chips, FAUs, SMDs, and related components
- Familiarity with Cadence, SolidWorks, and JMP
- Familiarity with FMEA, Control Plans, SPC, and 8D
- Fluent English communication skills in listening, writing, and speaking
What We Do
Lumilens addresses the red hot market for AI data center infrastructure by designing, manufacturing and selling photonic interconnect solutions. We design and use custom robotics + AI in our factories to more efficiently build our products. Lumilens is backed by top-tier venture capital investors including Mayfield and Spark Capital.
