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Lead global sourcing for foundry and OSAT partners: develop supplier strategy, secure wafer/assembly/test capacity, run RFQs and should-cost analysis, negotiate contracts/MSAs, resolve commercial and delivery issues, and align sourcing with engineering and product roadmaps.

Design and optimize high-speed silicon photonic devices and PICs (modulators, photodetectors, passive components). Perform multi-domain simulations (EM, circuit, thermal) to meet 200G/lane+ targets. Implement PIC layouts (GDS) using foundry PDKs and support tapeouts. Co-design with electronics and packaging for RF, parasitics, signal integrity, and thermal constraints. Support silicon bring-up, characterize devices, correlate measurement with simulation, drive design iterations, and contribute to design libraries and methodology.

Lead strategic sourcing for silicon photonics, packaging, and optical components. Build supplier strategy, negotiate contracts, manage supplier performance, ensure supply continuity, support NPI-to-HVM transitions, and drive cost and risk reduction across cross-functional teams.

Lead reliability and qualification for photonic components (silicon photonics, lasers, SiPs). Define and execute Telcordia/JEDEC-aligned qualification plans, perform ALT, failure analysis, degradation modeling, and supplier qualification. Collaborate across R&D, packaging, manufacturing, and supply chain to enable NPI and transfer to volume production, and document reliability reports and risk assessments.

Lead full-chip and block-level physical implementation for advanced-node ASICs (5nm/3nm), owning floorplanning, placement, CTS, routing, signoff, and power/timing closure while collaborating with RTL, STA, IP, and verification teams to resolve high-speed transceiver implementation challenges.

The Silicon Photonics Engineer will develop high-performance photonic devices, enhance manufacturing processes, and collaborate with teams for production scaling.

Lead process development for III-V etching, coating, and related fabrication modules; translate product requirements into process specs and control plans; define tooling and metrology; design and run DOEs to optimize yield and manufacturability; qualify vendors and tools; document and institutionalize processes; collaborate with device, packaging, manufacturing, and external fabs to troubleshoot and scale.

Lead HR operations for the Thailand team, coordinating recruiting, onboarding, employee support, and office administration. Build scalable processes, create 30/60/90 day onboarding plans, partner with HR, IT, and managers, and serve as local HR point of contact while improving recruiting efficiency and candidate experience.

Responsible for SI/PI design of 1.6T OSFP modules, conducting simulations and validations, defining design constraints, collaborating with teams, debugging, and contributing technical documentation.

The Power Integrity Engineer will optimize power distribution networks for OSFP designs, performing simulations and collaborating with teams to ensure low-noise power delivery and mitigate interference in high-speed modules.