At Lumilens, we’re building the critical photonics infrastructure that powers tomorrow’s AI supercomputing. Our technology enables faster, cooler, and more efficient computing through cutting-edge optical solutions and high-performance connectivity IPs. If you’re driven by innovation and eager to shape the future of AI infrastructure, we invite you to join our world-class engineering team.
Play a key role in developing high-speed connectivity IPs using advanced semiconductor process technologies.
Design and implement complex analog, mixed-signal, and RF layouts for high-performance connectivity IPs, including floorplanning, device placement, and routing.
Work closely with circuit designers to translate schematics into robust physical implementations from floorplanning through tapeout.
Own physical verification and signoff closure including DRC, LVS, ERC, antenna, DFM, and EMIR.
Optimize layouts using extraction results to meet performance, matching, noise, and reliability targets.
Contribute to layout reviews and help drive effective layout methodologies and best practices.
Improve layout productivity and quality through automation, scripting, and AI-assisted workflows.
Develop high-performance connectivity IPs used in AI, networking, and next-generation compute systems.
BE/B.Tech or MS/M.Tech in Electrical/Electronics Engineering, Microelectronics, or a related field with 5–10 years of experience in analog, mixed-signal, RF, or custom layout development.
Hands-on experience with layouts for SerDes, data converters, clocking circuits, power management, transceiver building blocks, or related connectivity IPs.
Proven experience in full-custom layout and signoff including RC extraction, DRC, LVS, ERC, DFM, and EMIR.
Exposure to silicon photonics, co-packaged optics (CPO), near-package optics (NPO), optical transceivers, or high-bandwidth connectivity solutions is a strong plus.
Experience with advanced semiconductor technologies including CMOS, FinFET, BiCMOS, or SiGe.
Strong understanding of semiconductor process technologies, device physics, and layout-dependent effects.
Proficiency with Cadence Virtuoso and industry-standard EDA tools.
Experience leveraging automation, scripting, or AI-assisted methodologies to improve layout productivity and quality.
Solid understanding of layout techniques including matching, shielding, clock distribution, power planning, ESD protection, latch-up prevention, manufacturability, and reliability-aware design.
Demonstrated success delivering complex layouts through tapeout.
Ability to work effectively with globally distributed design, verification, CAD, and technology teams.
Experience supporting multiple projects in a fast-paced product development environment.
Work alongside leaders and innovators in the photonics and semiconductor industry
Opportunity to make an impact on the infrastructure powering next-generation AI and high-performance computing
Fast-paced, collaborative, and mission-driven environment
Competitive compensation and benefits
Join us at Lumilens and help shape the future of compute connectivity!
Skills Required
- BE/B.Tech or MS/M.Tech in Electrical/Electronics Engineering, Microelectronics, or a related field
- 5-10 years of experience in analog, mixed-signal, RF, or custom layout development
- Hands-on experience designing layouts for SerDes, data converters, clocking circuits, power management, transceiver building blocks, or related connectivity IPs
- Full-custom layout and signoff experience, including RC extraction, DRC, LVS, ERC, DFM, and EMIR
- Experience with advanced semiconductor technologies such as CMOS, FinFET, BiCMOS, or SiGe
- Strong understanding of semiconductor process technologies, device physics, and layout-dependent effects
- Proficiency with Cadence Virtuoso and industry-standard EDA tools
- Experience with automation, scripting, or AI-assisted methodologies for layout productivity and quality
- Understanding of matching, shielding, clock distribution, power planning, ESD protection, latch-up prevention, manufacturability, and reliability-aware design
- Demonstrated success delivering complex layouts through tapeout
- Ability to work effectively with globally distributed design, verification, CAD, and technology teams
- Experience supporting multiple projects in a fast-paced product development environment
- Exposure to silicon photonics, co-packaged optics, near-package optics, optical transceivers, or high-bandwidth connectivity solutions
What We Do
Lumilens addresses the red hot market for AI data center infrastructure by designing, manufacturing and selling photonic interconnect solutions. We design and use custom robotics + AI in our factories to more efficiently build our products. Lumilens is backed by top-tier venture capital investors including Mayfield and Spark Capital.
