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Manages outsourced semiconductor backend capacity across OSAT sites, including wafer bumping, CP testing, packaging, and final testing. Responsibilities include capacity modeling, equipment and manpower allocation, bottleneck removal, capacity forecasting, audits, NPI capacity design, OEE monitoring, and continuous improvement. The role coordinates with planning, R&D, sustaining, and OSAT teams to ensure stable production capacity and readiness for mass production.

Owns GaN power-device value propositions, product roadmaps, and system-level market strategy across Taiwan and China. Translates customer requirements into product and system solutions for performance computing, AI data centers, server PSUs, and related applications. Engages customers, distributors, sales, and engineering teams; supports design-ins through mass production; resolves issues; and develops technical collateral, whitepapers, presentations, and reference architectures. Requires extensive power-electronics product or applications marketing experience and frequent Asia travel.

Leads global development of high-voltage and ultra-high-voltage SiC power modules from architecture and prototyping through qualification, manufacturing ramp, and production release. Establishes packaging materials, assembly processes, reliability methods, testing, and manufacturing readiness. Oversees OSAT strategy, supplier qualification, yield and quality improvement, technical risk mitigation, and cross-functional execution while building and developing a multidisciplinary engineering organization.

Create and maintain bond shell, package outline, and single-unit drawings for semiconductor packages; produce 3D models for thermal/thermomechanical simulations; manage drawing directories, revisions, and weekly request status reports; collaborate with packaging engineers and global teams.

Lead GaN package design and development: define BOM/process flows and package layouts, perform risk assessments and simulations, run assembly validation and reliability qualification with OSAT, analyze yield and CPK, produce documentation and customer sample support, and lead cross-functional teams.

Lead company-wide operating expense forecasting, three-statement modeling, and the Annual Operating Plan. Partner with department budget owners, support investor relations and board materials, maintain SOX controls, and develop an international FP&A team while driving AI-driven automation and ERP data interoperability to improve forecast accuracy.

Manage semiconductor reliability lab operations including scheduling burn-in tests, hardware and inventory control, vendor coordination, SOPs, equipment maintenance, NPI hardware readiness, team tasking, and budget tracking to support device qualification and production support.

Plan and execute qualification and reliability testing for high-voltage GaN and SiC power devices to JEDEC/AEC standards. Track and report reliability metrics, perform FMEA and root-cause analysis, coordinate cross-functional qualification activities, manage external test vendors, operate bench instrumentation, and qualify suppliers to improve cost, quality, and lead time.

Develop, validate, and release wafer sort, final test, characterization, and module test solutions for SiC/GaN products. Create and debug test programs and hardware, execute electrical and dynamic testing across conditions, analyze test data for yield and reliability, support ATE/prober qualification and transfer, automate data collection and reporting, and support NPI and sustaining engineering activities.

Lead Pune test engineering team to develop, validate, and release wafer sort, final test, characterization, and module test solutions for SiC/GaN power semiconductors. Manage ATE, probers, handlers, test hardware, and supplier coordination; drive correlation, yield analysis, root-cause, automation, and production ramp support while ensuring safety, quality, and continuous improvement.