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One Month AgoSaved
Hybrid
Wrocław, Dolnośląskie, POL
Senior level
Senior level
3D Printing
Develop complex cloud applications for the Altium 365 platform. Build cloud-native applications and scalable infrastructure, design APIs and data models, implement stateful and stateless services, work with databases and ORM frameworks, and contribute to microservices and cloud solutions. The role requires technical ownership, collaboration, problem-solving, and influence over engineering standards, best practices, and technical governance.
Top Skills: .NetAIAlibaba CloudAWSAzureCloud SolutionsFirebirdGoogle Cloud PlatformMachine LearningMicroservicesOracleOrm FrameworksPostgresRelational Databases
One Month AgoSaved
Hybrid
Katowice, Śląskie, POL
Senior level
Senior level
3D Printing
Develop complex cloud applications for the Altium 365 electronics design platform. Build cloud-native applications, scalable infrastructure, microservices, APIs, data models, servers, databases, and ORM-based systems. The role requires solving complex technical challenges, influencing technical direction, defining engineering standards and governance, and working autonomously while collaborating with a global engineering team.
Top Skills: .NetAIAlicloudAWSCloud ComputingFirebirdGoogle Cloud PlatformMachine LearningMicroservicesAzureOracleOrm FrameworksPostgresRelational Databases
One Month AgoSaved
In-Office
Kallithéa, GRC
Senior level
Senior level
3D Printing
Lead end-to-end digital verification for complex ASIC and IC blocks and systems. Responsibilities include defining verification strategies and test plans, building UVM environments, driving functional and code coverage closure, applying constrained-random testing, SVA, and formal verification, reviewing specifications, collaborating with architecture, design, and software teams, mentoring junior engineers, improving automation flows, and evaluating third-party verification tools and VIP.
Top Skills: Cadence XceliumConstrained-Random TestingEmanagerFormal VerificationRegression FrameworksSystemverilogSystemverilog Assertions (Sva)UvmVerilogVhdlVmanager
One Month AgoSaved
In-Office
Bengaluru, Bengaluru Urban, Karnataka, IND
Senior level
Senior level
3D Printing
Owns semiconductor products from engineering material planning and prototype builds through qualification, production release, sustaining, and end of life. Responsibilities include BOM and PLM management, NPI scheduling, ATE test and qualification planning, first-silicon debugging, characterization, yield and quality analysis, manufacturing optimization, product cost improvement, and cross-functional coordination with design, test, manufacturing, foundry, OSAT, and operations teams.
Top Skills: Advantest V93000AecAgile PlmAteJedecJmpPdf ExensioSpcTeradyne J750
One Month AgoSaved
In-Office
Seongnam-si, Gyeonggi-do, KOR
Internship
Internship
3D Printing
Supports analog and mixed-signal IC development, including transistor- and system-level architecture, PVT performance analysis, circuit modeling, simulation, layout guidance, silicon evaluation, ATE data analysis, test coverage, datasheet validation, and root-cause analysis. Collaborates with digital, layout, test, and international engineering teams to develop and validate high-performance semiconductor IPs.
Top Skills: Analog Integrated CircuitsAutomated Test Equipment (Ate)CadenceCmosDc-Dc ConvertersFpgaMixed-Signal CircuitsMultimeterOscilloscopePythonVerilog
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One Month AgoSaved
Hybrid
Bengaluru, Bengaluru Urban, Karnataka, IND
Expert/Leader
Expert/Leader
3D Printing
Design and implement digital DFT for automotive power management ICs, including scan insertion, ATPG, LBIST, test-pattern validation, scan-coverage improvement, RTL coding, synthesis, timing analysis, and gate-level simulation. Collaborate with architecture, design, physical implementation, test, and silicon validation teams. Deliver and debug production test patterns, support ASIL-B/D requirements, lead design reviews, and document specifications and processes. The role requires onsite work three days per week.
Top Skills: AteAtpgCadenceCdcDftGate-Level SimulationLbistLintMentorP&RRtlScan InsertionSiemensSynopsysSynthesisSystemverilogTetramaxTiming AnalysisVerilog
Reposted One Month AgoSaved
Remote or Hybrid
Oita, JPN
Expert/Leader
Expert/Leader
3D Printing
Lead development and integration of next-generation medium-voltage shielded-gate trench MOSFET processes. Define process modules, perform wafer probing and electrical analysis, support derivative technology and yield improvement, and drive technology transfer to mass production while collaborating with design, applications, marketing, and foundry partners.
Top Skills: Package-Level Performance AnalysisSemiconductor Fabrication ProcessesShielded-Gate Trench Mosfet TechnologyTcadWafer ProbingWafer-Level Electrical Testing
Reposted One Month AgoSaved
Hybrid
Hsinchu County, TWN
Expert/Leader
Expert/Leader
3D Printing
Lead development and industrialization of medium-voltage shielded-gate trench MOSFET technologies: define process modules, run wafer probing and electrical analysis, support derivative products, improve yield, and transfer technology to mass production while collaborating with design, applications, marketing, and foundry partners.
Top Skills: Package-Level TestingProcess IntegrationSemiconductor FabricationSi-Based MosfetTcadTrench MosfetWafer ProbingWafer-Level Electrical Test
Reposted One Month AgoSaved
In-Office
Taichung City, TWN
Expert/Leader
Expert/Leader
3D Printing
Lead global packaging sustaining engineering for high-volume semiconductor production across Asia. Manage Japan and Malaysia assembly groups, OSAT relationships, supplier governance, yield and cost optimization, PCN/PDN and MRB, customer RMA and failure analysis, and drive continuous improvement using SPC, DOE, PFMEA and analytics.
Top Skills: 2.5D8DAbfAutomotive QualificationsBoard Level Reliability TestingDoeEtsFcbgaFccspFcqfnIpcJedecModuleMrbMsapOsatPcnPdnPfmeaQfnQfpRcaSipSmtSpcSyl/SblTentingWarpageWlcsp
Reposted One Month AgoSaved
Remote or Hybrid
Takasaki, Gumma, JPN
Expert/Leader
Expert/Leader
3D Printing
Lead process integration for next-generation medium-voltage shielded-gate trench MOSFETs: define process modules, run TCAD/simulation analyses, perform wafer probing and electrical test analysis, drive yield improvement, support technology transfer and derivative product development with foundry and cross-functional teams.
Top Skills: Device SimulationMosfetSemiconductor FabricationTcadTrench MosfetWafer Probing
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