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Develops and improves digital IC verification environments and architectures. Responsibilities include understanding design functionality, creating verification environments, running RTL and gate-level simulations, managing regressions, and achieving code and functional coverage closure. The role requires expertise in SystemVerilog, UVM, verification planning, testbenches, assertions, debugging, industry-standard verification tools, computer architecture, and large-scale verification environments.

Provide semiconductor test operations and engineering support across internal factories and OSAT suppliers. Manage lot tracking, test program releases, hardware troubleshooting, equipment uptime, tester utilization, capacity expansion, technology deployment, and probe/final test transfers. Drive improvements in OEE, yield, cycle time, retest, and gross margins while coordinating with product, supply chain, quality, packaging, foundry, and PMO teams across global locations.

Leads strategic procurement activities for new product introduction and long-term semiconductor capacity planning. Owns NPI sourcing readiness, supplier segmentation, RFQ preparation, supplier selection rationale, and capacity risk mitigation before mass-production handoff. Coordinates Product Groups, engineering, supply chain, OSAT buyers, and suppliers while providing management updates. The role requires strong semiconductor supply chain expertise, strategic sourcing capability, supplier management, data analysis, and cross-functional leadership.

Leads the channel marketing team supporting semiconductor system-solution growth. Manages distribution and third-party partner relationships, co-op marketing activities and budgets, solution launches, NPI go-to-market execution, partner training, customer project tracking, validation, distributor inventory availability, and performance analysis. The role also drives team development, resource alignment, cross-functional collaboration, and marketing optimization.

Leads Renesas’ channel marketing team and mass-market growth initiatives for semiconductor system solutions. Manages distribution and third-party partner relationships, co-op marketing budgets, solution launches, partner training, customer project tracking, and NPI go-to-market execution. Coordinates cross-functional teams to ensure product availability at launch and analyzes performance reports to identify optimization opportunities. Requires semiconductor and applications experience, leadership capability, project management skills, and strong partner engagement.

Designs and develops semiconductor package and interconnect technologies for power SiP/modules, wafer-level packages, flip-chip, and power devices. Leads materials, process, subcontractor, DOE, qualification, reliability, production control, ramp-up, and process integration activities. Resolves manufacturing and customer issues, establishes package design rules, monitors quality, and contributes to packaging roadmaps. Requires strong expertise in Cu FSM/BGBM, bumping, wafer processing, assembly, SPC, and statistical analysis.

Designs and develops semiconductor package and interconnect technologies, including power SiP/modules, wafer-level packages, flip-chip, LGA, and power devices. Qualifies materials, processes, packages, and manufacturing partners; runs DOE and establishes process specifications and production controls. Resolves integration and production issues, supports qualification and ramp-up, maintains package design rules, contributes to technology roadmaps, and collaborates with product, reliability, quality, marketing, operations, OSATs, and customers.

Designs and develops semiconductor package and interconnect technologies for power SiP/modules, wafer-level packages, flip-chip, multi-chip modules, and power devices. Leads materials, process, subcontractor, DOE, qualification, reliability, production transition, ramp-up, and process control activities. Resolves integration and production issues, establishes package design rules, supports customer complaints, and contributes to packaging roadmaps. Requires strong expertise in Cu FSM/BGBM, bumping, wafer processing, assembly, qualification, SPC, and statistical analysis.

Develop and execute solutions marketing and positioning strategies for Renesas semiconductor solutions serving humanoid robotics customers in Southeast China. Translate robotics architecture challenges into technical narratives, reference designs, customer materials, white papers, and sales enablement content. Lead market discovery, customer workshops, solution architecture documentation, competitive positioning, and field team training while aligning customer requirements, sales, analyst messaging, and product adoption.

Designs, debugs, validates, and commercializes embedded hardware platforms for robotic joint controllers, dexterous-hand controllers, main control boards, and related systems. Responsibilities include circuit architecture, component selection, schematic and PCB design, sensor and actuator integration, industrial and high-speed interface development, prototype testing, root-cause analysis, reliability validation, and mass-production introduction. The engineer collaborates with software, mechanical, algorithms, testing, and supply-chain teams across Renesas MCU, MPU, and SoC platforms.