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Develops and integrates advanced BCD semiconductor technologies from concept through qualification and manufacturing readiness. Responsibilities include device and process integration, BEOL module development, yield and reliability improvement, process-window definition, defectivity control, tooling readiness, manufacturability trade-offs, and cross-functional technical issue resolution. The role supports high-voltage, memory, capacitor, CMOS, DMOS, imaging, packaging, and post-fab technology initiatives in an advanced 300 mm manufacturing environment.

Provides comprehensive administrative support to leaders and teams, including complex calendar management, domestic and international travel coordination, expense reporting, document and presentation preparation, meeting logistics, confidential information handling, office supply management, digital filing, onboarding support, and coordination with IT and Facilities. The role also supports operational projects, improves administrative processes, and collaborates with administrative partners across global organizations.

Supports 300mm wafer lithography manufacturing by maintaining track processes and equipment health, executing experiments and DOE studies, analyzing process data, monitoring CD, overlay, focus, exposure, and defectivity, investigating excursions, supporting lot disposition, and partnering cross-functionally on troubleshooting, qualifications, tool matching, yield improvement, and manufacturing readiness.

Owns product-level engineering for SiC and silicon power MOSFETs across global new product development programs. Leads product definition, architecture, die-to-package alignment, cross-functional execution, risk management, design reviews, escalation, and technical task forces. Translates customer and business requirements into engineering deliverables while balancing performance, reliability, cost, manufacturability, and schedule. Provides executive-level communication and drives resolution of complex technical challenges across semiconductor, packaging, test, quality, manufacturing, and supply chain teams.

Designs and optimizes low- to medium-voltage silicon power MOSFETs, emphasizing shielded-gate trench architectures. Uses Synopsys Sentaurus TCAD for process and device simulations, defines layouts and mask structures, collaborates on process integration and manufacturability, and validates models through electrical characterization and reliability analysis. Requires advanced semiconductor device physics expertise and experience bringing discrete power devices from concept through high-volume manufacturing.

Develops and improves semiconductor yield management systems supporting wafer fabrication, assembly, testing, quality, and manufacturing. Responsibilities include data integration, data quality, vendor and application management, software solution design, automated reporting, yield analysis methods, documentation, and training. The role partners with IT, engineering, quality, manufacturing, and software vendors to improve yield, reduce scrap, support product ramps, and optimize semiconductor manufacturing analytics.

Develops technical marketing strategy, collateral, sales tools, training, and solution messaging for onsemi’s Power Solutions Group. Builds relationships with engineering, sales, channel partners, and strategic customers; provides application insights, opportunity support, competitor analysis, product performance analysis, and market intelligence. Requires an engineering background, 8–10 years of experience, strong communication skills, and 15% domestic travel.

Install, qualify, maintain, and improve MOCVD equipment used for vertical GaN wafer processing. Troubleshoot equipment and process issues, improve reliability and uptime, lead vendor engagement, and support equipment scaling from development into production. The role requires cleanroom experience, equipment ownership, calibration, maintenance, diagnostics, semiconductor manufacturing knowledge, and cross-functional collaboration.

Summer intern supporting a 300mm Post Fab Module Engineering team in improving semiconductor manufacturing performance, quality, cycle time, cost, yield, and device performance. Responsibilities include collecting equipment and process data, developing process or controls improvements, evaluating materials and equipment, troubleshooting issues, implementing corrective actions, collaborating cross-functionally, and following safety and quality standards.

Intern will support thin-film, implant, and diffusion engineering teams in defining, developing, and implementing integrated-circuit manufacturing processes. Responsibilities include collaborating on process improvements, optimizing standards and documentation, investigating manufacturing challenges, analyzing statistical data, presenting findings, and occasionally assisting with laboratory characterization. The role is based in Fishkill, New York and is intended for students pursuing electrical engineering or a semiconductor-related degree.