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Design and lead development of digital and mixed-signal electronics for space and airborne systems from concept through production. Responsibilities include schematic and PCB design (Altium), signal and power integrity analysis, FPGA and high-speed interface implementation, lab bring-up and verification, release to production, and mentoring small hardware teams. Requires strong communication and cross-disciplinary collaboration.

Develop and maintain FPGA/digital verification infrastructure, build UVMf testbenches and reusable VIPs, integrate DPI-C with MATLAB/Python models, support CI/regression and emulation, mentor engineers, evaluate FPGA verification processes and vendor simulation models, and apply Xilinx-focused tool workflows.

Lead design, development, analysis, and testing of liquid rocket engine hardware and propulsion subsystems. Design parts (gimbals, bellows, pipelines), own requirements and system integration, perform CFD/FEA, develop and run test programs, generate technical documentation, and collaborate with mechanical, aerospace, and controls teams to deliver flight-ready hardware.

Provide advanced SolidWorks CAD modeling and drawing support across the product lifecycle. Maintain PDM systems, version control, BOMs, and ECO processes. Ensure GD&T and drafting standards compliance, review manufacturability, collaborate with engineering/manufacturing/quality, mentor junior designers, and drive CAD process improvements for aerospace hardware development.

Administer and maintain Linux servers and infrastructure supporting launch operations, ensuring reliability, security, patching, monitoring, backups, and rapid troubleshooting. Collaborate with engineering, network, and cybersecurity teams, support operational readiness during tests and launches, document procedures, and drive infrastructure automation and compliance.

Lead mission assurance activities ensuring design, manufacturing, integration, and test meet customer and regulatory requirements. Implement and tailor QA/Mission Assurance processes, manage supplier compliance, drive risk management, lead failure investigations, support audits and reviews, and provide training and guidance across teams.

Design and analyze mechanical aspects of phased-array antennas and payloads from concept through flight: requirements, CAD/FEA, thermal and packaging, manufacturing, testing/qualification, deployment mechanisms, EMI/EMC mitigation, and customer/executive presentations and proposal support.

Perform complex RF and mixed-signal PCB layout (up to ~30 GHz) in Altium, manage Altium Enterprise libraries, generate release packages and drawings, create schematic symbols/footprints, maintain templates/BOMs, and collaborate with hardware and mechanical engineers on high-reliability aerospace designs using advanced manufacturing techniques.

Lead mechanical design for space and aerospace products across concept, requirements, detailed design, simulation, manufacturing, testing, qualification, and in-orbit support. Focus on electronics packaging, thermal management, FEA, shock/vibration, EMI/EMC mitigation, GD&T, cost analysis, CNC manufacturability, and mentoring; present to customers and executives.

Lead capture and proposal efforts for government and commercial satellite communications opportunities. Develop win strategies, manage cross-functional proposal teams, perform pricing/BOE reviews, ensure compliance with procurement regulations, build customer relationships, support negotiations, and transition wins to program execution with baselined requirements, cost, and schedule.