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Lead yield improvement, reliability qualification, failure analysis, and process qualification for advanced substrate fabrication. Drive root-cause analysis, SPC and yield modeling, reliability test planning/execution (environmental, mechanical, electrical), and support ramp to production. Coordinate across process, equipment, test, quality, and customer teams to reduce scrap and meet qualification requirements.

Lead electroplating and backend thick-Cu integration efforts, drive R&D to high-volume manufacturing, optimize dicing/etch/solder ball attach processes, implement DOE/statistical root-cause analysis, collaborate with external partners, support manufacturing continuous improvement to raise yields, quality, and efficiency while reducing costs.