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Lead RF PCB layout from placement through manufacturing release using Altium. Define stack-ups, controlled-impedance routing, grounding/shielding, connector launches, and DFM/DFT. Collaborate with RF, antenna, mechanical, and test engineers to ensure first-pass RF performance and drive lab bring-up and qualification.

Develop and run automated test frameworks and embedded firmware to validate radar payloads. Build HIL setups, control lab instruments, analyze performance data, and maintain CI pipelines to ensure hardware-software integration and space-readiness.

Lead PCB layout engineer responsible for end-to-end high-speed and mixed-signal PCB physical implementation in Altium. Define stack-ups, impedance and length-matching constraints, reference plane strategies, and partitioning to meet SI/PI and DFM requirements. Collaborate with electrical, firmware, mechanical, and test teams to run reviews, support lab bring-up, and release manufacturable boards for space applications.

Design and validate digital and mixed-signal electronics for radar payloads and satellite platforms, lead prototyping, bring-up, testing, manufacturability, and qualification, collaborate across RF, antenna, mechanical, firmware and systems teams, and mentor junior engineers.

Design, simulate, prototype, and validate spaceborne antennas and arrays (patch, microstrip, phased). Perform full EM analysis (HFSS/CST/ADS), lab and anechoic chamber testing, support integration, flight verification, link budgets, and develop manufacturing/test procedures with cross-functional teams.

Design and validate digital and mixed-signal spacecraft electronics for radar payloads and satellite platforms, including high-speed interfaces, precision timing, power regulation, telemetry, and fault-tolerant systems. Lead prototyping, bring-up, testing, manufacturing, and iterative improvement across laboratory, environmental, and on-orbit qualification efforts while collaborating with RF, antenna, mechanical, software, and systems teams.

Design and validate digital and mixed-signal electronics for radar payloads and satellite platforms. Responsibilities include architecture, component selection, schematic capture, PCB design, prototyping, bring-up, test, manufacturing oversight, and iterative improvement based on lab, environmental, and on-orbit testing while collaborating across RF, antenna, mechanical, firmware, and systems teams.