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Develop cutting-edge firmware for Solid State Drives, lead architectural requirements, review product source code, and conduct testing in a fast-paced Agile team environment.

Interns will gain hands-on experience in Business Analysis, Supply Chain Operations, and Business Management, contributing to high-impact projects in strategic planning, data analysis, and logistics.

Interns will support engineering workflows, contribute to AI tools, analyze data, and improve processes while developing skills in a collaborative team environment.

The TD Design Collateral Modeling Engineer develops and refines design models, performs electrical validations, and collaborates across teams to meet NAND performance targets.

Lead enhancement of finance applications with focus on SAP S/4 HANA, identify efficiencies, collaborate with teams, and manage projects.

The Principal Power Architect will define power architecture for SSDs and SoCs, focusing on performance, power management, and collaboration across various teams to innovate solutions that maximize energy efficiency and performance.

The role involves processing APAC payroll, responding to employee inquiries, maintaining payroll records, and ensuring compliance with payroll regulations across multiple countries.

Support the sales team by addressing customer technical issues in pre-sales and post-sales phases, while also building local capabilities and managing customer requests.

The Package Developer will innovate packaging technologies for SSD and NAND products, perform design analysis, and manage cross-functional teams while ensuring product standards.

Develop and maintain firmware for SSDs, analyzing specifications, testing, and collaborating in Agile. Requires strong experience in embedded systems and C/C++.