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Lead electrical characterization and test development for semiconductor and quantum devices. Design and execute DC/RF/pulsed/transient measurements, reliability tests, and cryogenic experiments. Develop automated test programs, operate probe and RF/cryogenic test systems, analyze large datasets, correlate results with process/materials, and document methodologies to support device validation and yield improvement.

The M&A Lead Integration Architect will strategize and implement integration plans for acquired entities, collaborating with various teams to ensure seamless transitions and alignment with business goals.

The Director manages M&A accounting to ensure compliance with U.S. GAAP/IFRS, coordinates with stakeholders, and leads accounting training initiatives.

Develop, deploy, and validate Process Design Kits (PDKs), compact models, and PCells for quantum devices and cryogenic control/readout ICs. Integrate PDKs into EDA flows, design test chips, run validation and QA (DRC/LVS), analyze device/circuit data for yield and reliability, and collaborate across device, process, and EDA teams to enable manufacturable quantum platforms.

Lead development and roadmap for topological qubit platforms, driving experiments, simulations, and prototypes. Advance materials (III-V, epitaxy, superconductors), device architectures, cryogenic measurement and system integration. Translate innovations into semiconductor-compatible solutions, set technical benchmarks, collaborate with partners, and mentor engineering teams to mature scalable, manufacturable quantum technologies.

The Engineer will develop process flows and recipes for manufacturing, ensure methods for testing devices, analyze defective products, and implement process control methods while ensuring compliance with safety regulations.

The Manufacturing Cost Analyst will be involved in the product costing process, support budgeting, analyze performance, and conduct variance analysis across multiple locations.

The Technical Program Manager will lead silicon photonics programs, ensure delivery accountability, manage risks, and influence multi-site teams while driving customer engagement and operational efficiencies.

Lead the integration team for quantum modalities at GF Labs, focusing on process integration, technology roadmap execution, and stakeholder advocacy. Drive recruitment and oversee operational excellence in quantum hardware development.

The Principal Engineer will lead die-package co-design strategies, define package architecture, perform system-level analyses, and mentor junior engineers. The role emphasizes collaboration with various teams and customer engagement while staying current with semiconductor design trends.