Top Tech Jobs & Startup Jobs

Coordinate CVD process and EB evaporation for mass production, involved from pilot to full-scale manufacturing, and plan new projects.

Develops and modifies InP-based Lithography processes, introduces new equipment, and manages projects from pilot to mass production.

Manage the portfolio management system, ensure data integrity, support user training, build reports, and optimize processes. Collaborate with teams to drive efficiency.

Develop new lithography processes for InP-based technologies, set process conditions for mass production, and contribute to project planning and equipment selection.

The Staff Process Integration Engineer oversees wafer fabrication processes, collaborates with engineering teams, resolves production issues, and drives process improvements for III-V Semiconductor optoelectronic devices.

The role involves firmware design for optical communication products, low-level driver development, hardware/software communication, and troubleshooting within embedded platforms.

Lead development, optimization, and qualification of thin-film, metal deposition, and backend wafer processes. Drive yield, cycle-time, and reliability improvements using SPC/DOE/Six Sigma and Lean methods. Support equipment qualification, NPI, troubleshooting, documentation, and cross-functional collaboration in a semiconductor cleanroom environment.

Design, develop, test, and support process automation software for optical test and verification from NPI to volume manufacturing. Collaborate with R&D, Manufacturing, and Quality to deliver scalable, well-documented test applications, share best practices, and support process engineers at manufacturing sites.

Lead Japan import/export operations and trade compliance: manage customs, export controls, brokers, logistics, and trade risk. Implement Global Trade program, deliver training, advise on product/sourcing changes, and drive process improvements and automation to ensure regulatory compliance and supply continuity.

Designs and simulates high-speed RF channels and test boards for 800G/1.6T+ modules and 128Gbaud+ components. Performs 3D EM and channel simulations, PCB material/stack-up selection, RF testing and problem root-cause, and cross-team technical coordination and reporting.