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Develops advanced thermal management technologies for microelectronic, aerospace, and automotive systems. Responsibilities include designing and fabricating thermal components and microsystems, planning heat-transfer experiments and test campaigns, conducting thermal and thermo-structural modeling, collaborating with multidisciplinary teams, communicating research through presentations and publications, documenting inventions, supporting patents, and writing research proposals.

Manage government-funded R&D programs involving sensors and multidisciplinary engineering teams. Own integrated schedules, budgets, earned value, risks, suppliers, subcontractors, contractual compliance, proposals, and customer reporting. Ensure adherence to FAR/DFARS, export controls, and AS9100 requirements while guiding development-to-production transitions in aerospace and semiconductor environments.

Develops system-level validation plans, test criteria, documentation, and release-readiness coverage for advanced electronic assemblies and IMUs. Performs hardware assembly, testing, characterization, troubleshooting, and data analysis using electronic test equipment and automation tools. Partners cross-functionally on requirements flow-down, configuration control, engineering changes, prototype preparation, production transition, and external qualification. Reports results to technical teams and management while supporting embedded hardware, firmware, and instrumentation integration.

Designs superconducting component layouts for silicon spin quantum computing using Virtuoso and related CAD tools. Develops layout automation for routing, via placement, ground-plane slotting, and metal or dielectric fill. Applies foundry constraints, RF design principles, and manufacturability requirements while collaborating with process, integration, packaging, and design teams. Troubleshoots DRC/LVS issues, supports simulations and reviews, and documents layout methodologies, automation scripts, and design rules.

Build, integrate, test, operate, and maintain cryogenic and vacuum systems supporting silicon quantum dot technologies. Perform electro-mechanical assembly, troubleshooting, leak checks, maintenance, documentation, and subsystem integration. Use SolidWorks for fixture and tooling design, coordinate system builds, manage equipment and inventory, support procurement, and contribute to laboratory infrastructure and process improvements.

Develop and validate thermal and mechanical finite element models for superconducting interposer systems operating at millikelvin to 4 K temperatures. Build CAD geometries, define material models and simulation conditions, analyze stress and deformation, and validate predictions against low-temperature measurements. Collaborate with packaging, process, and device engineering teams on design, manufacturing, reliability, and failure mitigation. Document methodologies and communicate technical findings and recommendations to engineering teams and senior management.

Lead analog and mixed-signal verification for cryogenic CMOS quantum-control circuits. Develop AMS verification strategies, behavioral models, SystemVerilog/UVM environments, assertions, regressions, and coverage methodologies. Perform transistor-level simulations, corner and Monte Carlo analysis, model correlation, DFT verification, silicon bring-up, lab debugging, and measurement validation. Automate workflows with scripting and maintain Git/Jenkins continuous integration. Collaborate across design, modeling, DFT, digital verification, and validation teams from block development through tape-out.

Designs, characterizes, and validates cryogenic mixed-signal electronics for qubit control and readout. Responsibilities include RF/microwave and high-speed digital design, low-temperature measurements, PCB and silicon bring-up, FPGA/ASIC verification, automated laboratory testing, data analysis, debugging, and hardware-firmware co-design. The engineer collaborates with multidisciplinary teams to improve control fidelity, noise performance, reliability, and system robustness in an on-site laboratory environment.

Designs and analyzes superconducting and non-superconducting integration components, including packages, connectors, transmission lines, and RF interconnects. Performs RF simulations of cryogenic superconducting structures, evaluates signal behavior and parasitics, and integrates foundry, materials, packaging, and test constraints into manufacturable designs. Collaborates across engineering teams, supports foundry problem-solving and process development, interprets test data, documents methodologies, and communicates technical recommendations to leadership.

Designs, fabricates, integrates, and tests RF and millimeter-wave subsystems for communications, radar, and sensing applications. Responsibilities include electronic modeling and simulation, circuit analysis, customer problem solving, invention disclosures, technical presentations, proposal support, and collaboration with scientists, engineers, program managers, and customers. The role requires familiarity with RF components, FPGAs, DSPs, microcontrollers, programming tools, and electronic test equipment, with travel of approximately 20%.