Top Tech Jobs & Startup Jobs

Develop verification plans and mixed-signal testbenches for analog and mixed-signal ICs using Cadence Virtuoso and SystemVerilog. Create automated checks, measurements, coverage regressions, and specification compliance matrices; report results, track issues, and drive bugs to closure with cross-functional design teams. The role includes regression scripting, verification-flow improvements, and structured training through TI’s Career Accelerator Program.

Leads design verification for high-speed SerDes transceivers used in automotive, industrial, enterprise, and consumer electronics. Applies digital design and modeling knowledge, debugs complex signal-conditioning and data-path designs, and supports reliable, low-power semiconductor development in advanced CMOS processes.

Evaluates, selects, installs, upgrades, maintains, and supports semiconductor manufacturing equipment. The role monitors equipment performance and reliability, improves uptime, resolves manufacturing-impacting equipment issues, supports repair and process engineering teams, and develops preventive maintenance programs. Expertise with semiconductor equipment, vacuum technologies, cleanroom protocols, SPC, and equipment monitoring is preferred.

Develops and implements probe and final tests for complex mixed-signal power management devices. Responsibilities include creating test plans and programs, designing ATE interface hardware, characterizing and debugging silicon, analyzing yield and failure data, optimizing test time, supporting qualification, and transitioning products to volume production. The role requires electrical engineering expertise, analog ATE experience, circuit knowledge, laboratory equipment skills, and product engineering experience.

Designs high-speed mixed-signal communication chips and digital circuits interfacing with analog circuitry. Responsibilities include RTL coding, simulation, synthesis, timing closure, verification, evaluation, and debugging at circuit and behavioral levels. The role also develops test methods, specifications, application materials, data sheets, and demo boards while collaborating closely with analog and digital engineering teams.

Develops and qualifies semiconductor products, particularly buck converters, from new product introduction through high-volume manufacturing and field performance monitoring. Responsibilities include package and assembly definition, reliability qualification, manufacturing process setup, root-cause analysis, yield and quality improvements, cost reduction, and collaboration with global design, test, packaging, manufacturing, and quality teams.

Designs high-speed mixed-signal communication chips and digital circuits interfacing with analog circuitry. Responsibilities include RTL coding, simulation, synthesis, timing closure, verification, evaluation, debugging, test method development, specifications, application materials, datasheets, and demo boards. Collaborates closely with analog and digital engineering teams to solve complex problems and deliver projects on time.

Develops and qualifies semiconductor products, focusing on IC packaging, assembly, manufacturing processes, reliability testing, production ramp-up, yield improvement, and field performance. Collaborates globally with design, test, process, manufacturing, quality, and applications teams to resolve failures, improve quality, reduce costs, and ensure reliable high-volume production of DC-DC converter products.

Maintains and improves semiconductor wirebond manufacturing equipment, including evaluating, installing, upgrading, troubleshooting, and monitoring KNS and ASM machines. Develops preventive maintenance schedules, improves equipment uptime and reliability, supports manufacturing and process engineering teams, and ensures effective documentation and safety practices. The role requires hands-on experience with wirebond equipment, semiconductor manufacturing, bonding processes, cleanroom protocols, and analytical manufacturing tools.

Provides technical application support for DDR PMICs used in data centers. Responsibilities include customer design-in support, schematic and layout reviews, board-level debugging, EVM and reference design development, bench characterization, automation, datasheet and application note creation, and new silicon evaluation. The role collaborates with systems engineers and global DRAM customers while supporting product qualification and adoption.