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Lead startup, development, and optimization of CMP processes for DRAM production. Drive yield, defectivity, cost, and productivity improvements; resolve manufacturing issues; collaborate with equipment and integration engineers; manage projects to hit milestones; own and improve SPC charts; travel internationally for onboarding and training; adopt Agentic AI and data science/programming tools to improve workflows.

Leads strategic and tactical planning for semiconductor equipment engineering, including capacity, automation, equipment performance, tool qualification, maintenance priorities, and manufacturing readiness. Drives AI-enabled engineering practices, advanced analytics, digital transformation, and continuous improvement to improve reliability, throughput, resource use, and business performance. Manages organizational resources, training, processes, and cross-functional collaboration across fab engineering and manufacturing teams.

The Tactical Capacity Engineer will manage capacity heatmap analysis, communicate metrics across departments, and implement projects for capacity improvement using engineering concepts.

Evaluate, maintain, and improve semiconductor assembly equipment and manufacturing processes. Optimize equipment capacity, cost, utilization, and performance; analyze alarms and tool signals; support equipment installation, validation, upgrades, and buyoff; design equipment improvements; coordinate with vendors; document procedures and incidents; and apply analytical methods and AI to identify process and equipment improvements.

Evaluate, maintain, troubleshoot, and improve semiconductor assembly equipment and manufacturing processes. The role focuses on equipment optimization, capacity and cost improvement, process deviation prevention, equipment validation, component design, performance analysis using AI, technical documentation, and vendor coordination. It supports wafer-level molding, dicing, thinning, mounting, debonding, tool alarm analysis, equipment installation, setup, and buyoff.

Develop and maintain metrology measurement recipes and inspection strategies to detect defects and improve yield. Use advanced analytics and SPC to monitor tools, design experiments to find defect sources, collaborate with cross-functional teams and suppliers, and run projects to improve inline detection, efficiency, cost, and tool availability. Integrate AI-assisted tools and provide data-driven recommendations to support fab operations and continuous improvement.

Establishes and improves semiconductor manufacturing processes, including process conditions, equipment parameters, capability, cost, and management projects. Evaluates and plans new equipment and materials, investigates abnormalities, and implements process improvements. The role also incorporates AI-assisted tools to improve efficiency, quality, analysis, and operational effectiveness.

Lead site learning and development by implementing training plans, conducting needs analyses, designing OJT and onboarding, mentoring employees, managing training data and reports using digital/AI tools, collaborating with stakeholders, and driving change management and continuous improvement to enhance operational capability.

Evaluates and improves HBM assembly manufacturing processes, materials, and equipment. The role involves equipment installation, setup, qualification, buyoff, troubleshooting, process optimization, root-cause analysis, corrective actions, equipment component design, supplier coordination, tooling selection, and evaluation of emerging technologies. The engineer also applies manufacturing quality methods and uses AI-enabled tools, automation, and data analytics to improve engineering effectiveness and operational performance.

Supports HBM memory and logic design through RTL development, circuit implementation, simulation, verification, timing and power analysis, debugging, and functional validation. Develops scripting, automation, and AI-assisted workflows to improve engineering productivity. Collaborates with design verification, physical design, CAD, and product engineering teams while documenting technical findings and methodologies.