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The CE PYE FA Engineer conducts fault isolation and failure analysis, collaborates with engineering teams, and develops innovative techniques to improve defect resolution.

Responsible for leading a production team to meet goals related to quality, cost, and efficiency. The role involves performance feedback, training, communication, and managing initiatives for improvement in manufacturing systems.

Drive SoC physical implementation from netlist to GDSII including floorplanning, placement, CTS, routing, timing closure (MMMC), power integrity, and physical signoff. Integrate complex IP, partner with DFT/packaging/manufacturing, support tape-out and post-silicon debug, and improve flows via scripting and automation.

The role involves architecting scalable verification solutions for HBM products, driving verification strategies, engaging with customers, and mentoring engineers.

The Process Technician will monitor and maintain equipment, perform preventative maintenance, troubleshoot issues, and support cycle time reduction in semiconductor packaging processes.

The role involves electrical failure analysis, fault isolation, collaboration with product engineering, and process improvement strategies.

The role involves overseeing manufacturing methods, resources, and personnel; enhancing operational performance; and driving continuous improvement initiatives while managing budgets and customer relations.

Coordinate New Product Introduction program timelines, improve product yield, manage performance indices, and optimize inventory through analytics. Requires collaboration with engineering teams.

The Process and Equipment Engineer will manage production line health with a focus on troubleshooting, risk assessment, process optimization, and improving product quality in semiconductor wafer production.

As a Fab Engineer, you will optimize processes, improve product quality and reliability, and resolve manufacturing issues using analytical methodologies.