Top Tech Jobs & Startup Jobs

Work on DRAM design, IC layout using design tools, and evaluate prototype wafers/chips with test equipment (function, speed, power, voltage). Provide feedback to process and design teams. Communicate with stakeholders via phone/email. Training provided; accommodations for disabilities.

Lead verification of high-speed DDR & ONFI PHY IP using SystemVerilog/UVM and mixed-signal simulators. Develop RNM/Verilog-AMS models, enable full-chip co-simulation (GLS) and power-aware verification (UPF/CPF). Own testplan-to-signoff, mentor junior engineers, and collaborate with digital and analog designers to ensure functional and analog interface correctness.

Lead a Photo engineering team to transfer and implement new photolithography techniques, develop and optimize photo recipes, monitor equipment performance, resolve process integration challenges, and drive continuous improvement to maximize yield and efficiency.

Lead verification architecture and plans for HBM DRAM IP and SoC integration. Drive co-verification with customers, mentor engineers, develop methodology and GenAI tools, and debug pre-/post-silicon issues while proposing scalable verification solutions.

Lead global Dry Etch Tool Installation Qualification (TIQ) programs to meet cost and schedule targets, define and improve TIQ processes and documentation, drive cross-functional alignment, track performance against Best-in-Class goals, and apply AI/digital tools to increase operational efficiency.

The role involves enhancing DRAM/NAND process yields through collaboration, data analysis, and experimental design, ensuring quality and reliability in production.

Develop, deploy, and sustain process control systems (SPACE SPC, Applied E3, MES/MAM/RMS) for Assembly & Test. Configure SPC/FDC models, ensure equipment-to-host connectivity (SECS/GEM), govern OCAP/recipes, monitor metrics, perform RCA, automate tasks with SQL/Python, and maintain audit-ready documentation while collaborating with cross-functional teams.

Develop and improve wafer thinning and CMP processes for advanced packaging. Coordinate experiments, troubleshoot process issues, perform root cause analysis, and support on-site project execution. Lead materials and mechanical characterization, design test structures, present technical reports, and liaise with global teams and suppliers to meet specifications and roadmaps.

The Total Productive Management Equipment Engineer will enhance manufacturing efficiency through TPM activities, manage global projects, implement automation technologies, improve product quality, and develop new suppliers.

Develop and optimize semiconductor process conditions and parameters, improve process capability and cost, manage process projects, evaluate and plan new equipment/materials, and perform abnormality analysis and process improvements.