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Provides administrative, documentation, coordination, and office operations support for an engineering department. Responsibilities include managing schedules, records, reports, meetings, engineering change documentation, procurement coordination, NPI logistics, KPI tracking, equipment records, onboarding, training, and cross-functional communication. The role also supports AI- and data-driven manufacturing enablement using MES, equipment, yield, analytics, and machine learning data.

Support SSD products from development and qualification through high-volume manufacturing. Drive manufacturing test bring-up, product qualification, firmware and test validation, production readiness, yield improvement, and system-level failure analysis. Analyze test data and manufacturing performance, resolve root causes with cross-functional engineering teams, and develop automation, analytics, and AI-enabled solutions to improve product quality and engineering efficiency.

Develop and test high-performance firmware for memory controllers and solid-state drives. Evaluate builds, conduct bench testing, debug failures, analyze issues, triage defects, file bug reports, and isolate problems with cross-functional engineering teams. The role requires embedded firmware expertise, Python programming, storage-industry experience, knowledge of NAND flash and storage interfaces, independent execution, and leadership of junior engineers or technicians.

The Product Manager will drive strategy for High Performance Memory products, managing customer engagement and product development in AI and HPC sectors.

Supports global procurement through cost analysis, should-cost modeling, market intelligence, benchmarking, procurement analytics, and AI-enabled process improvements. The intern analyzes pricing and industry trends, identifies cost-saving opportunities, supports construction and capital project categories, and collaborates with category managers, program managers, and business partners to improve procurement decisions and operational efficiency.

The Senior Manager leads Frontend Operations, ensuring effective team performance, equipment performance improvement, and process standardization while demonstrating leadership and fostering team growth.

Leads the wet process equipment engineering organization for high-volume semiconductor manufacturing. Owns equipment strategy, reliability, availability, throughput, yield, quality, maintenance, contamination control, and technology readiness across wet clean, wet etch, and related systems. Develops engineering leaders and technical talent while partnering cross-functionally on technology introductions, factory ramps, capacity expansion, and capital projects. Drives continuous improvement through analytics, automation, predictive maintenance, digital manufacturing, and equipment performance optimization.

Leads global spares engineering and strategic programs across semiconductor manufacturing sites. Owns category strategies, cost and productivity improvements, equipment availability, supply resilience, governance, roadmaps, risk management, and executive reporting. Collaborates with engineering, operations, planning, supply chain, suppliers, and regional teams while conducting benchmarking and technology scouting. Requires engineering expertise, semiconductor experience, data-driven decision-making, and domestic and international travel.

Develop, optimize, and sustain vapor-phase etch and cleaning processes (HF-based) for DRAM manufacturing. Own single-wafer vapor etch modules, drive defectivity reduction, perform RCA and statistical root-cause analysis, lead process qualification and transfers, collaborate with equipment and yield teams, and apply data/AI tools to improve yield, cost, and productivity.

As a Principal Engineer in the HIG HBM Team, you will design Application-Specific Integrated Circuits for High Bandwidth Memories, lead layout teams, manage projects, and contribute to innovative semiconductor technologies for AI and HPC applications.