Top Tech Jobs & Startup Jobs

Lead development, optimization, qualification, and control of dry film resist (DFR) develop and strip processes for glass panel semiconductor manufacturing. Drive DOE, root-cause analysis, process qualifications, equipment acceptance, SOPs, and continuous improvement to reduce defects, improve pattern fidelity and yield, and support pilot-to-volume manufacturing ramps while ensuring EHS compliance.

Lead a team of engineers to sustain and improve semiconductor etch and thin-film manufacturing processes. Drive process qualification, DOE/statistical problem solving, yield and quality improvements, tool maintenance, incident investigations, and documentation to support safe, efficient production.

Develop and oversee RF test platforms for IPD and SiP modules, support NPI and production wafer acceptance, automate measurements and data analysis, characterize devices with RF instrumentation, design test fixtures and PCBs, manage technicians, and support reliability and yield improvement.

Lead development, optimization, qualification, and control of electroless copper deposition for glass substrates and panel-level packaging. Define process parameters, drive DOE and root-cause analysis, improve deposition uniformity and adhesion, support pilot-to-volume ramp, maintain process documentation and EHS compliance, and collaborate with equipment, chemistry, and maintenance teams to enhance yield and equipment reliability.

Lead development, optimization, qualification, and manufacturing support of wet etching processes for TGV and copper in glass panel semiconductor manufacturing. Mentor engineers, define critical process parameters, drive DOE/SPC-based characterization, troubleshoot defects, support pilot-to-volume ramp, and own equipment qualification (SAT, IQ/OQ/PQ) to improve yield and process robustness.

Lead yield improvement, reliability qualification, failure analysis, and process qualification for advanced substrate fabrication. Drive root-cause analysis, SPC and yield modeling, reliability test planning/execution (environmental, mechanical, electrical), and support ramp to production. Coordinate across process, equipment, test, quality, and customer teams to reduce scrap and meet qualification requirements.

Lead electroplating and backend thick-Cu integration efforts, drive R&D to high-volume manufacturing, optimize dicing/etch/solder ball attach processes, implement DOE/statistical root-cause analysis, collaborate with external partners, support manufacturing continuous improvement to raise yields, quality, and efficiency while reducing costs.