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Electrical Engineering Interns will design, prototype, test, integrate, and document PCBAs and electrical systems for semiconductor manufacturing equipment. Responsibilities include schematic capture, layout, system bring-up, simulations, troubleshooting, requirements definition, and cross-functional collaboration with software, mechanical, and process teams. Interns will work on lithography, deposition, vacuum, motion-control, and plasma-etching systems while rapidly developing and productionizing hardware solutions.

Lead cross-functional hardware program development for a semiconductor fab, translating goals into technical programs, managing schedules, risks, and integration from requirements through production release, and building lightweight PM systems.

Seeking hands-on engineers across mechanical, electrical, software, and nanofabrication to design and build full-stack chip-making hardware and software, iterate quickly, and develop fabs, tools, and components in a San Francisco lab.

Lead end-to-end characterization and testing of positioning tools: build automated test programs, run electrical and software tests, diagnose complex cross-disciplinary failures, document results, and drive engineering improvements. Portfolio required.

Design, prototype, and build semiconductor fabrication tools and subsystems (deposition, etch, anneal, plasma). Own end-to-end mechanical and electromechanical systems, source components, partner with cross-functional teams, and validate vacuum and fluid-handling hardware for production.

Design, prototype, and build semiconductor fabrication equipment and subsystems. Lead system integration, testing, and cross-team coordination. Develop electrical designs and PCBs, execute mechanical CAD and fabrication, rapidly prototype and test, source components, and write light software/firmware. Portfolio required.

Design, prototype, and build robotic automation and electromechanical systems for semiconductor packaging. Create mechanical assemblies, integrate microcontrollers/PLCs, sensors, actuators, and firmware, validate control systems, source components, and collaborate cross-functionally. Applicants must provide a portfolio of hands-on projects.

Characterize CMOS devices, design and fabricate test chips and probe cards, develop test plans and automation, deploy parameter-extraction (e.g., BSIM) tools, analyze electrical data, and provide feedback to process engineers to improve materials and process flows.

Design and run experiments to develop and optimize semiconductor and thin-film fabrication methods. Operate deposition, etch, lithography, and metrology tools; develop and transfer process recipes; analyze process data, troubleshoot equipment and recipes, and document results. Read technical literature to inform experiments and mentor/partner with senior engineers to improve yield, consistency, and throughput.

Design, build, deploy, and operate on-prem, bare-metal backend infrastructure for a semiconductor fab. Own servers, networking, observability, backups, OS image automation, secrets management, and infrastructure-as-code to deliver reliable, high-performance systems that support fab operations.