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Lead full-chip and block-level physical implementation for advanced-node ASICs (5nm/3nm), owning floorplanning, placement, CTS, routing, signoff, and power/timing closure while collaborating with RTL, STA, IP, and verification teams to resolve high-speed transceiver implementation challenges.

Lead material and supply planning for new product introductions from prototype through pilot and design qualification. Translate engineering build plans into material and procurement plans, ensure BOM and component readiness, identify long-lead and single-source risks, track equipment procurement, align materials with CM partners, support ECO-driven plan updates, and deliver planning analytics and supply readiness reporting to cross-functional leadership.

Lead sourcing and end-to-end supply chain for optical/photonics components. Own supplier identification, qualification, negotiations, capacity planning, risk mitigation, dual-source strategies, and cross-functional alignment. Track supplier performance, maintain supply roadmaps, and drive continuous improvement to meet prototype through production ramps.

Lead process development for III-V etching, coating, and related fabrication modules; translate product requirements into process specs and control plans; define tooling and metrology; design and run DOEs to optimize yield and manufacturability; qualify vendors and tools; document and institutionalize processes; collaborate with device, packaging, manufacturing, and external fabs to troubleshoot and scale.

The Silicon Photonics Engineer will develop high-performance photonic devices, enhance manufacturing processes, and collaborate with teams for production scaling.

Lead HR operations for the Thailand team, coordinating recruiting, onboarding, employee support, and office administration. Build scalable processes, create 30/60/90 day onboarding plans, partner with HR, IT, and managers, and serve as local HR point of contact while improving recruiting efficiency and candidate experience.

Responsible for SI/PI design of 1.6T OSFP modules, conducting simulations and validations, defining design constraints, collaborating with teams, debugging, and contributing technical documentation.

The Power Integrity Engineer will optimize power distribution networks for OSFP designs, performing simulations and collaborating with teams to ensure low-noise power delivery and mitigate interference in high-speed modules.

The Failure Analysis Engineer investigates optical, electrical, and mechanical failures in transceivers, collaborates with teams on root cause analysis, and develops testing infrastructure.

The role involves driving reliability execution for photonic components, collaborating with cross-functional teams, executing qualification plans, and conducting reliability testing and analysis.