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Lead development of packaged silicon photonics and optical interconnect products from requirements through validation and production. Define product requirements, analyze optical links, coordinate engineering and external partners, guide packaging and assembly execution, and establish testing strategies. The role requires hands-on laboratory work, customer and supplier engagement, cross-functional leadership, and attention to manufacturability, reliability, thermal performance, and scale-up readiness.

Support strategy, execution, adoption, and lifecycle management for high-speed optical interconnect product lines. Analyze customer and market requirements, competitive intelligence, technical trade-offs, and business metrics for 800G and 1.6T transceiver platforms. Coordinate with engineering, sales, manufacturing, finance, operations, and customer teams to resolve issues, support design wins, execute roadmaps, identify risks, and develop customer proposals and business cases.

The Director of Silicon Test Engineering will lead test strategy and execution for silicon photonics products, optimizing test solutions and ensuring product reliability. Responsibilities include managing ATE test development, driving yield optimization, and collaborating with cross-functional teams while building a high-performing engineering team.

The role involves designing and optimizing advanced packaging solutions for ASICs, conducting FEA simulations, and collaborating with cross-functional teams to enhance photonics technologies for AI and high-performance computing.

As an IC Package FEA Engineer, you will conduct FEA simulations for advanced packaging solutions, optimize designs, and collaborate with cross-functional teams to enhance reliability and performance in photonic devices.

Lead software integration for high-speed optical transceivers on advanced switch architectures, ensuring automation and system debugging, collaborating with cross-functional teams.

The Failure Analysis Engineer leads investigations of optical, electrical, and mechanical failures, communicating insights to influence product design and improve manufacturing processes.

Lead development of wafer-level opto-electrical test solutions for NPO/CPO products across NPI to volume production. Design and qualify test hardware and software, manage RFQ and vendor qualification, transfer testers to production, create process documentation and training, and provide ongoing engineering support to maintain yield, throughput, alignment stability, and reliability.

Lead cross-functional programs across silicon, photonics, packaging, bring-up, validation, and system delivery. Create and execute project plans, manage risks and schedules, coordinate vendors and partners, and communicate status to leadership to drive product readiness on aggressive timelines.

Lead signal integrity analysis for photonic-electronic systems, collaborating with design teams to optimize high-speed data paths and package stack-ups.