Top Tech Jobs & Startup Jobs

Designs and optimizes ESD and Latch-Up protection for high-voltage BCD, analog, power, and mixed-signal ICs. Performs HBM, CDM, and TLP characterization, supports silicon debugging and failure analysis, develops design guidelines and ESD libraries, and leads risk assessment and design sign-off. Collaborates with foundries, technology teams, customers, and global engineering groups on reliability and ESD solutions.

Own verification of complex digital blocks and SoC features from planning through coverage closure. Develop reusable SystemVerilog/UVM environments, constrained-random and targeted tests, assertions, checkers, scoreboards, and coverage models. Debug RTL, testbench, firmware, and regression issues; automate regressions and reporting; and collaborate across architecture, design, firmware, analog, validation, and systems teams. Provide technical guidance and communicate risks, status, and signoff evidence.

Leads solutions marketing for Renesas industrial automation products, focusing on PLCs, edge sensing, motor control, and HMI interfaces. Engages key customers, channel teams, sales, FAEs, product groups, and system architects to identify opportunities, secure design wins, drive revenue, and shape product roadmaps. Responsibilities include market and competitive analysis, customer relationship development, strategic engagement planning, presentations, product collateral, competitive materials, and field training.

Leads RTL design and development for complex IPs and subsystems in MCU SoCs. Defines microarchitecture, supports SoC integration, and ensures PPA targets and design quality through lint, CDC, RDC, synthesis, and verification activities. Collaborates with architecture, verification, physical design, and software teams; mentors junior engineers; and improves RTL methodologies, coding standards, and design processes.

Define next-generation power management semiconductor products and roadmaps, translate customer and system requirements into product specifications, and support design-in activities. Provide technical assistance, circuit reviews, debugging, field-return analysis, training, and customer collateral. Lead FPGA prototyping, silicon evaluation, validation planning, system modeling, and design trade-off analysis while coordinating marketing, sales, design, and global engineering teams. Build and manage the application and system engineering team as business needs evolve.

Develop, execute, optimize, and document semiconductor test processes. Analyze production test data, investigate failures and yield issues, improve procedures and systems, reduce defects, and implement corrective actions. The role supports manufacturing efficiency, quality improvement, cross-functional collaboration, and occasional on-call duties.

Develops, executes, and optimizes semiconductor test processes to verify product functionality and quality. Responsibilities include test setup, production testing, yield and failure analysis, data analysis, defect reduction, corrective actions, process documentation, and continuous improvement. The role also supports automated test systems and cross-functional manufacturing initiatives.

Develops, executes, optimizes, and documents semiconductor test processes. Analyzes test data, yield, quality issues, and failures; drives defect reduction, corrective actions, process improvements, and production testing efficiency. Supports test procedures, systems, and continuous improvement initiatives while collaborating cross-functionally in a fast-paced manufacturing environment.

Architect and implement digital logic embedded in power, analog, and mixed-signal ICs. Own microarchitecture, RTL, synthesis, timing closure, DFT support, verification collaboration, and silicon bring-up. Design control, sequencing, protection, diagnostics, trimming, communication, test, and safety logic. Lead reusable design practices, technical reviews, cross-functional collaboration, and mentorship while managing area, power, timing, testability, and implementation trade-offs.

Qualify, develop, and sustain thin-die assembly processes for Power QFN and Cu Clip semiconductor packages. Responsibilities include improving yield, capacity, quality, and cost; qualifying suppliers and manufacturing sources; managing lifecycle documentation and supplier changes; resolving customer and production issues; supporting NPI-to-production transfers; and coordinating with quality, reliability, test, product engineering, OSAT, and contract manufacturing teams.