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The internship involves designing and testing firmware for SSDs, collaborating with teams, and developing validation test plans, aimed at students in engineering.

The TD Device Modeling Engineer will develop software and computational models to enhance 3D NAND technology through simulations and data analysis, collaborating with cross-functional teams.

The TD Design Collateral Modeling Engineer develops and refines semiconductor models, collaborates cross-functionally, and conducts electrical validations to meet NAND performance targets.

The internship involves contributing to firmware development, hardware validation, and AI-driven projects, providing hands-on experience across various engineering domains.

The internship involves validating SSDs by collaborating with engineering teams, executing qualification plans, and developing software in C++ and Python for reliability testing.

Develop cutting-edge firmware for Solid State Drives (SSD) focusing on embedded systems and storage interface standards while collaborating in Agile environments.

The role involves managing P&L analysis, preparing financial reports, and supporting management reporting processes to drive performance improvements.

The Director of Strategic Planning defines and executes NAND strategies and products, manages product life cycles, conducts market and competitive analysis, and drives cross-company initiatives.

As a DevOps Engineer, you will develop and maintain infrastructure for SSD product development, optimize pipelines, and automate deployments while collaborating with project stakeholders.

The Software Engineer will develop and maintain automation frameworks for testing embedded firmware, focusing on quality engineering and collaboration. Responsibilities include designing tools in C++ and Python, analyzing code, and participating in team activities.