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Serve as strategic partner to Head of Global SCM, coordinating leadership operating rhythm, driving cross-functional alignment, managing crises and escalations, leading high-priority initiatives and task forces, delivering executive reporting, and implementing continuous improvement to strengthen supply chain resilience and performance.

Lead R&D and implementation of semiconductor test technologies across global manufacturing. Evaluate, qualify, and introduce new test equipment and methodologies, manage cross-functional projects, collaborate with suppliers, deliver technical training, and drive continuous improvement and Industry 4.0 initiatives.

Maintain and update product master data, BOMs, and SAP production masters. Support NPIs, engineering changes, data governance, cross-functional coordination, process improvements, and PLM system adoption.

Drive design-win activity for BG MOS products across Taiwan, India and Southeast Pacific by providing technical support, training, application design materials, demos and simulations. Build relationships with customers and distributors, capture requirements and NPI opportunities, support marketing and visibility, and promote Nexperia support tools and product roadmaps.

Support and grow BG MOS design pipelines in China by providing tier-2 technical support and training, building relationships with design engineers and partners, creating application materials and demos, promoting tools and roadmaps, and supporting marketing initiatives to increase product visibility.

Serve as technical lead for die bonding equipment across pre- and post-sales: conduct demos, application trials, troubleshooting, training, documentation, and provide market feedback to R&D while supporting customers and collaborating with sales, engineering, and service teams.

Design, develop, and validate SMPS reference designs and application/evaluation boards. Create schematics, select components, collaborate on PCB layout, perform electrical/thermal/EMI validation, troubleshoot hardware, support customers and sales, produce technical documentation, and translate customer needs into product opportunities.

The Principal Device Engineer will lead TCAD development for Power Trench MOSFET technologies, optimize device architectures, analyze performance trade-offs, and ensure innovation through collaboration with cross-functional teams.

As a Senior Competitor Analyst, you'll conduct physical and electrical analysis of competitor MOSFETs, develop benchmarking insights, provide cost estimates, and monitor technology trends while collaborating with multiple teams.

Lead the SiC product portfolio across its lifecycle: define roadmap and strategy, drive NPI and business cases, meet revenue and margin targets, perform market intelligence, and coordinate cross-functional teams to accelerate market adoption and customer engagement.