Develops and improves IC assembly processes to increase production efficiency, quality, and yield. Responsibilities include process documentation, operator training, customer technical support, design of experiments, SPC and yield reporting, root cause analysis, corrective actions, equipment evaluation, and cost or quality improvements. The role requires hands-on semiconductor back-end process engineering experience, including assembly technologies such as die attach, wire bonding, wafer thinning, dicing, flip chip, and molding.