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The Package Reliability Engineer will conduct reliability analysis, manage OSAT collaborations, select materials, and perform failure analysis for advanced packaging systems.

Support technical customer engagements for photonics interconnects in AI infrastructure, focusing on deploying high-bandwidth, low-latency solutions and interacting with design teams and customers.

Lead system bring-up, validation, and DVT testing for optics in cutting-edge network products. Collaborate across teams to improve device performance and testing processes.

The Senior AMS Design Engineer will architect and implement high-speed analog and mixed-signal circuits for photonic transceivers and electronic ICs while collaborating with multidisciplinary teams.

The role involves developing high-performance digital designs for ASICs, optimizing power, performance, and area while ensuring timing closure and conducting post-silicon validation.

Manage complex semiconductor programs from IP development to platform delivery. Collaborate with engineering teams, manage customer interactions, and ensure program excellence.

Lead design verification for complex SOCs, guiding strategy, managing a team, and collaborating with engineers to ensure successful product releases.