Top Design Engineer Jobs

Designs, documents, tests, secures, and transitions global CAN/LAN and WAN network infrastructure. Responsibilities include network hardware configuration, routing and switching implementation, maintenance planning, troubleshooting support, DISA STIG compliance, ATO acquisition, technical documentation, and supervision of network support specialists. The role also supports production network operations and modernization across a mission-focused government enterprise.

Designs, upgrades, configures, and supports MPLS, WAN, and LAN network architectures for an intelligence community program. Develops secure network designs aligned with DISA STIGs, evaluates and integrates network technologies, supports ATO certification, and documents designs. Provides Tier-4 troubleshooting, QoS optimization, network analysis, fault isolation, and technical guidance to operations teams. Requires extensive network engineering experience, Juniper certifications or training, MPLS and routing expertise, DoD IAT Level 2 compliance, and strong documentation and communication skills.

Design and verify digital circuits for NAND memory products, create RTL/firmware/schematics, perform gate-level and post-layout simulations, develop verification plans, support silicon validation and tape-out, and collaborate across teams to meet performance, power, and reliability targets. Leverage AI tools to aid design and automation.

Designs and verifies physical layouts for advanced digital, analog, and mixed-signal semiconductor circuits. Responsibilities include floor planning, routing, power distribution network design, LVS and DRC verification, die-area estimation, and layout optimization for manufacturability, reliability, performance, and cost. Collaborates with cross-functional engineering teams and contributes to layout documentation, design reviews, methodology improvements, and memory product development.

Architects and implements RTL for next-generation HBM SoC logic dies, including memory subsystems, IP integration, interfaces, clocking, reset, power, and configuration infrastructure. Analyzes AI/ML hardware bottlenecks, drives architectural improvements, and supports pre-silicon validation, post-silicon bring-up, and silicon debug. Collaborates with architecture, verification, physical design, firmware, product engineering, test, manufacturing, and process teams to deliver high-performance, robust, and manufacturable designs.

Design and validate on-chip controllers and mixed-signal circuitry for NAND Flash chips. Responsibilities include architecture development, product definition, system integration, RTL implementation, synthesis, automated place and route, timing closure, firmware development, and full-chip and block-level validation. The engineer collaborates with domestic and international design teams across multiple projects.

Designs and analyzes analog and digital CMOS circuits for DRAM and memory products. Responsibilities include power delivery network optimization, circuit simulation and verification, chip layout, parasitic extraction, silicon performance validation, and collaboration with process integration, transistor modeling, product engineering, test, and manufacturing teams. The role also involves documenting specifications and designing, modifying, fabricating, and evaluating semiconductor devices and components.

Leads telecommunications infrastructure design and delivery across structured cabling projects, managing requirements, drawings, specifications, budgets, contractors, testing, construction milestones, quality assurance, and project closeout. Collaborates with stakeholders, architects, general contractors, integrators, and engineering teams to deliver resilient, secure, auditable infrastructure solutions. Applies authorized AI tools to infrastructure analysis and documentation while validating outputs and protecting sensitive data. Domestic travel of approximately 20% is required.

Lead advanced aerospace hardware design from concept through production for Honeywell Anthem displays. Responsibilities include schematic capture, PCB design support, analog and digital circuit development, hardware validation, troubleshooting, debugging, root-cause analysis, design verification, qualification, and stakeholder collaboration. The role also provides technical leadership and mentorship while ensuring compliance with aerospace standards including DO-254 and DO-160.

Design and document mechanical, fluid, and thermal systems and mechanism/kinematic components for a next-generation cruise missile. Perform detail design, computational analysis, supplier development, and prepare technical documentation while collaborating across multidisciplinary teams to meet safety, security, and program requirements.

Designs, develops, and analyzes static gas turbine engine components for aerospace applications. Performs finite element and classical stress analyses, including strength, fatigue, containment, heat transfer, modal, vibration, and crack growth analyses. Supports testing, project coordination, resource planning, design reviews, compliance, risk management, root-cause analysis, corrective actions, documentation, and process improvement initiatives.

Lead the structural design and development of primary and secondary aircraft structures for autonomous UAVs. Own CAD modeling, drawings, FEA, stress and fatigue analysis, material selection, design reviews, validation testing, and compliance documentation. Collaborate across aerodynamics, propulsion, avionics, manufacturing, and flight-test teams to transition designs into production and field deployment. Mentor engineers, support technical decisions, and improve engineering processes, configuration management, and design quality.

Owns digital architecture and synthesizable SystemVerilog RTL for high-speed interface ASICs from micro-architecture through tape-out. Responsibilities include CDC strategy, synthesis, timing constraints and closure, physical-design coordination, self-verification, assertions, DFT support, documentation, and mixed-signal integration. The role collaborates closely with analog, layout, verification, and characterization teams on PHY-adjacent silicon development.

Designs, simulates, and optimizes digital, analog, and DRAM memory circuits for advanced HBM products. Responsibilities include CMOS circuit design, floorplanning, layout leadership, simulation using FINESIM, HSPICE, and Verilog, tape-out validation, silicon correlation, documentation, and cross-functional technical leadership across engineering, manufacturing, test, and marketing teams.

The role involves architecting high-performance semiconductor memory test equipment, driving strategic development, collaborating across teams, mentoring, and influencing technical decisions to enhance testing infrastructure.

Supports the design, simulation, verification, and analysis of HBM memory and logic circuits. Develops RTL, performs timing and power analysis, creates automation scripts, and applies AI-assisted workflows to improve engineering productivity. Collaborates with design, verification, physical design, CAD, and product engineering teams while documenting technical findings and methodologies.

Leads custom analog and mixed-signal PHY circuit development from specifications through post-silicon characterization. Designs PLL, DLL, CDR, transmitter, and receiver circuits; makes PHY architecture decisions; develops transistor-level simulation testbenches; analyzes process corners, Monte Carlo variation, jitter, margins, and yield; defines analog-digital interfaces; collaborates on layout; and correlates simulations with lab measurements for high-speed chip-to-chip and memory interconnects.

Designs, tests, simulates, and validates analog and digital circuitry for precision accelerometers used in aerospace navigation. Responsibilities include full lifecycle hardware development, data analysis, test procedure definition, design reviews, project execution, schedule and budget support, product release, and factory root-cause corrective action. The engineer collaborates with systems, mechanical, manufacturing, and technical teams while supporting compliance with product requirements.

Leads the mechanical and thermal architecture of advanced memory and computing hardware. Designs and validates cooling solutions, performs CFD and FEA, defines reliability and manufacturability requirements, and oversees thermal, mechanical, and environmental testing. Drives design reviews, risk mitigation, root-cause investigations, and corrective actions while collaborating with electrical, manufacturing, reliability, and supplier teams. Mentors engineers, establishes technical guidelines, and contributes to industry standards and AI-enabled engineering workflows.

Designs, analyzes, and optimizes digital, analog, logic, and memory circuits for High Bandwidth Memory products. Performs circuit verification, parasitic modeling, simulations, layout support, validation, and tape-out activities. Collaborates with design, CAD, verification, product, process, test, and manufacturing teams to meet performance, reliability, and manufacturability goals. Uses AI-assisted tools and data-driven workflows to improve engineering productivity and design analysis.

Leads customer ASIC implementations, technical engagements, design-for-test activities, design reviews, quality and reliability efforts, documentation, and cross-functional project delivery. Provides technical leadership and mentorship while supporting ASIC design, fabrication, testing, packaging, timing closure, and semiconductor reliability activities.

Coordinates ECS component design and integration from development through validation and product launch. Conducts design, drawing, peer, DFMEA, and DRBFM reviews; performs technical analysis and root-cause investigations; collaborates with suppliers, manufacturing, and multidisciplinary engineering teams; manages program milestones, deliverables, quality, cost, and timing; and supports design changes and buildability.

Leads design release and development of thermal and cooling components for batteries, drive units, and internal combustion engines. Responsibilities include balancing system requirements, conducting DFMEA, planning testing and validation, releasing designs for manufacturing, managing engineering changes, resolving supplier and warranty issues, and coordinating cross-functional and vendor teams. The role also oversees budgets, cost improvements, quality assurance, and product development execution, with domestic and international travel as required.

Leads design release and development of thermal and cooling components for batteries, Drive Units, and internal combustion engines. Responsibilities include requirements balancing, design analysis, DFMEA, testing, validation, manufacturing release, supplier collaboration, engineering changes, warranty resolution, cost improvements, and cross-functional product development. The role manages complex engineering projects, coordinates internal and external stakeholders, and supports experimental builds and global powertrain development.

Own front-end technology and feasibility for next-generation floorcare products. Develop concepts, functional rigs, CAD layouts, 3D models, prototypes, and engineering studies spanning mechanical and electromechanical systems. Solve consumer and technical issues, validate designs through lab testing, collaborate with global engineering and product teams, and support product development through implementation. Coach junior colleagues while balancing multiple projects and deadlines.