Jobs at Navitas Semiconductor

Administer Model N and Microsoft Dynamics 365 by entering and maintaining sales data, quotes, registrations, pricing, and related transactions. Manage approval workflows, coordinate with cross-functional teams, validate data quality, resolve inconsistencies, maintain process documentation, generate reports, and support process improvements. The role requires strong attention to detail, accurate handling of high-volume data, effective English communication, and proficiency with Excel and office productivity tools.

Lead end-to-end new product introduction programs for GaN and SiC semiconductor products from concept through qualification, commercial launch, and production handoff. Manage gate reviews, schedules, risks, suppliers, foundry and OSAT coordination, cross-functional execution, executive reporting, and NPI process improvements. Directly manage and mentor junior program managers and interns while using Microsoft 365, AI productivity tools, and dashboards to track program health and launch readiness.

Supports and progressively owns new product introduction programs for GaN and SiC power semiconductor products from kickoff through qualification, release, and production handoff. Maintains schedules, milestones, risks, action items, gate reviews, status dashboards, and cross-functional deliverables. Coordinates engineering, quality, operations, supply chain, suppliers, and foundries while tracking qualification activities and escalating delays. Contributes to process improvements and uses Microsoft 365 and AI productivity tools for documentation and reporting.

Define semiconductor products and technologies with customers and engineering teams; lead market research, competitor analysis, product positioning, pricing, go-to-market planning, and design-in strategies. Support new product introduction, technical documentation, customer design-ins, and third-level support alongside sales and field applications teams. The role focuses on high-voltage SiC power semiconductors for AI data centers, energy, and grid infrastructure.

Leads flagship GaN and SiC semiconductor new product introduction programs from concept through qualification, launch, and production ramp. Builds and manages the NPI program organization, establishes governance and gate criteria, drives cross-functional execution, manages portfolio risks, and oversees capacity planning, manufacturing readiness, yield improvement, product cost, and gross margin initiatives. Presents program status to executive, customer, and board-level stakeholders while improving NPI processes, analytics, and organizational capabilities.

Supports Device and Product Engineering teams by collecting, organizing, and tracking wafer lot data across GaN and SiC products. Assists with basic wafer- and part-level yield calculations, database or spreadsheet maintenance, data validation, lot status tracking, and creation of simple charts and trend summaries. This learning-focused internship provides exposure to semiconductor manufacturing data and practical analytics skills.

Lead end-to-end architecture, design, verification, tape-out, silicon bring-up, validation, debugging, yield improvement, and production release for analog and power management ICs. Collaborate with systems, device, modeling, layout, EDA, and validation teams; guide physical design and floor planning; evaluate AC-DC and DC-DC architectures; support failure analysis; and mentor junior engineers.

Supports high-voltage SiC MOSFET testing and characterization, power electronics schematic and PCB design, evaluation board validation, laboratory measurements, and converter simulations using PLECS and SIMetrix. Develops technical documentation, supports field application engineers and customer enablement, and collaborates with R&D, marketing, quality, and operations teams. Requires an Electrical Engineering degree, hands-on high-voltage power electronics experience, and knowledge of semiconductor applications, isolation, gate drivers, and power converter topologies.

The Controller oversees accounting operations, financial close, SEC reporting, tax, inventory and cost accounting, controls, audits, and SOX compliance. The role supports financings, M&A, regulatory filings, technical accounting research, internal and external audits, and reporting process improvements. It requires strong US GAAP and SEC expertise, international entity and intercompany experience, active CPA certification, and extensive accounting leadership experience.

Leads semiconductor assembly process characterization, NPI risk assessment, process documentation, subcontractor coordination, tooling procurement, and production qualification through mass production release. Manages critical NPI builds, investigates quality and yield issues, supports customer-return resolution, and coordinates cross-functional and global teams. Requires semiconductor backend process engineering expertise, especially in wafer saw, laser groove, die bonding, wire bonding, or end-of-line assembly, plus proficiency with structured engineering problem-solving tools.

Manages outsourced semiconductor backend capacity across OSAT sites, including wafer bumping, CP testing, packaging, and final testing. Responsibilities include capacity modeling, equipment and manpower allocation, bottleneck removal, capacity forecasting, audits, NPI capacity design, OEE monitoring, and continuous improvement. The role coordinates with planning, R&D, sustaining, and OSAT teams to ensure stable production capacity and readiness for mass production.

Owns GaN power-device value propositions, product roadmaps, and system-level market strategy across Taiwan and China. Translates customer requirements into product and system solutions for performance computing, AI data centers, server PSUs, and related applications. Engages customers, distributors, sales, and engineering teams; supports design-ins through mass production; resolves issues; and develops technical collateral, whitepapers, presentations, and reference architectures. Requires extensive power-electronics product or applications marketing experience and frequent Asia travel.

Leads global development of high-voltage and ultra-high-voltage SiC power modules from architecture and prototyping through qualification, manufacturing ramp, and production release. Establishes packaging materials, assembly processes, reliability methods, testing, and manufacturing readiness. Oversees OSAT strategy, supplier qualification, yield and quality improvement, technical risk mitigation, and cross-functional execution while building and developing a multidisciplinary engineering organization.

Create and maintain bond shell, package outline, and single-unit drawings for semiconductor packages; produce 3D models for thermal/thermomechanical simulations; manage drawing directories, revisions, and weekly request status reports; collaborate with packaging engineers and global teams.

Lead GaN package design and development: define BOM/process flows and package layouts, perform risk assessments and simulations, run assembly validation and reliability qualification with OSAT, analyze yield and CPK, produce documentation and customer sample support, and lead cross-functional teams.

Lead company-wide operating expense forecasting, three-statement modeling, and the Annual Operating Plan. Partner with department budget owners, support investor relations and board materials, maintain SOX controls, and develop an international FP&A team while driving AI-driven automation and ERP data interoperability to improve forecast accuracy.

Manage semiconductor reliability lab operations including scheduling burn-in tests, hardware and inventory control, vendor coordination, SOPs, equipment maintenance, NPI hardware readiness, team tasking, and budget tracking to support device qualification and production support.

Plan and execute qualification and reliability testing for high-voltage GaN and SiC power devices to JEDEC/AEC standards. Track and report reliability metrics, perform FMEA and root-cause analysis, coordinate cross-functional qualification activities, manage external test vendors, operate bench instrumentation, and qualify suppliers to improve cost, quality, and lead time.

Develop, validate, and release wafer sort, final test, characterization, and module test solutions for SiC/GaN products. Create and debug test programs and hardware, execute electrical and dynamic testing across conditions, analyze test data for yield and reliability, support ATE/prober qualification and transfer, automate data collection and reporting, and support NPI and sustaining engineering activities.

Lead Pune test engineering team to develop, validate, and release wafer sort, final test, characterization, and module test solutions for SiC/GaN power semiconductors. Manage ATE, probers, handlers, test hardware, and supplier coordination; drive correlation, yield analysis, root-cause, automation, and production ramp support while ensuring safety, quality, and continuous improvement.