Jobs at Navitas Semiconductor

Leads ultra-high-voltage SiC device and process technology from architecture and simulation through fabrication, characterization, reliability qualification, and foundry transfer. Serves as technical lead and principal investigator for U.S. government-funded programs, manages milestones and deliverables, develops patents, supports customers, and mentors engineers across global sites. Focus areas include 3.3 kV–10 kV+ MOSFETs, diodes, JFETs, bipolar devices, process integration, TCAD, and high-voltage reliability testing.

Lead product engineering for GaN power semiconductor devices from silicon evaluation and NPI through qualification, production ramp, and sustaining engineering. Own characterization, CP/FT test strategy, yield improvement, datasheet validation, reliability assessment, and qualification readiness. Analyze device physics, manufacturing variation, and power switching behavior while coordinating cross-functional investigations with device, process, reliability, quality, test, applications, wafer fab, and OSAT teams.

Lead SiC technology development and characterization for power devices and modules. Define test architectures, perform root-cause analysis, drive reliability learning/qualification, architect experiments, build automated analysis platforms, and mentor engineers to accelerate robust SiC solutions across device, process, package, and application domains.

Lead development, characterization, qualification, and improvement of SiC power devices. Plan and execute electrical and reliability tests, analyze wafer/package/application data, perform root-cause and statistical analysis, drive DOE and technology transfers, build automated data workflows and dashboards, prepare technical reports, and mentor junior engineers to advance SiC device platforms and qualification readiness.

Lead reliability qualification and failure analysis for SiC and GaN power devices and modules. Develop accelerated stress tests, lifetime-acceleration models, and root-cause investigations; correlate electrical, thermal, material, and process data; produce qualification reports and recommendations; collaborate with device, process, packaging, and quality teams.

Manage global sales operations across forecasting, pipeline hygiene, bookings, backlog, quote-to-cash, and design-win tracking. Coordinate with Sales, Supply Chain Management, Customer Service, and distribution teams to align demand forecasts with capacity, production, inventory, and customer commitments. Lead S&OP participation, monitor supply and inventory risks, improve forecast accuracy, and provide leadership with booking, pipeline, and supply-demand performance insights.

Supports SiC MOSFET products from engineering samples through characterization, qualification, release, and sustaining support. Develops electrical characterization plans, analyzes wafer probe and final-test data, evaluates yield and reliability, optimizes test limits and screening requirements, investigates product excursions, supports qualification and lot disposition, and prepares release documentation. Collaborates with device, quality, reliability, manufacturing, assembly, test, and applications teams.

Administer Model N and Microsoft Dynamics 365 by entering and maintaining sales data, quotes, registrations, pricing, and related transactions. Manage approval workflows, coordinate with cross-functional teams, validate data quality, resolve inconsistencies, maintain process documentation, generate reports, and support process improvements. The role requires strong attention to detail, accurate handling of high-volume data, effective English communication, and proficiency with Excel and office productivity tools.

Lead end-to-end new product introduction programs for GaN and SiC semiconductor products from concept through qualification, commercial launch, and production handoff. Manage gate reviews, schedules, risks, suppliers, foundry and OSAT coordination, cross-functional execution, executive reporting, and NPI process improvements. Directly manage and mentor junior program managers and interns while using Microsoft 365, AI productivity tools, and dashboards to track program health and launch readiness.

Supports and progressively owns new product introduction programs for GaN and SiC power semiconductor products from kickoff through qualification, release, and production handoff. Maintains schedules, milestones, risks, action items, gate reviews, status dashboards, and cross-functional deliverables. Coordinates engineering, quality, operations, supply chain, suppliers, and foundries while tracking qualification activities and escalating delays. Contributes to process improvements and uses Microsoft 365 and AI productivity tools for documentation and reporting.

Define semiconductor products and technologies with customers and engineering teams; lead market research, competitor analysis, product positioning, pricing, go-to-market planning, and design-in strategies. Support new product introduction, technical documentation, customer design-ins, and third-level support alongside sales and field applications teams. The role focuses on high-voltage SiC power semiconductors for AI data centers, energy, and grid infrastructure.

Leads flagship GaN and SiC semiconductor new product introduction programs from concept through qualification, launch, and production ramp. Builds and manages the NPI program organization, establishes governance and gate criteria, drives cross-functional execution, manages portfolio risks, and oversees capacity planning, manufacturing readiness, yield improvement, product cost, and gross margin initiatives. Presents program status to executive, customer, and board-level stakeholders while improving NPI processes, analytics, and organizational capabilities.

Supports Device and Product Engineering teams by collecting, organizing, and tracking wafer lot data across GaN and SiC products. Assists with basic wafer- and part-level yield calculations, database or spreadsheet maintenance, data validation, lot status tracking, and creation of simple charts and trend summaries. This learning-focused internship provides exposure to semiconductor manufacturing data and practical analytics skills.

Lead end-to-end architecture, design, verification, tape-out, silicon bring-up, validation, debugging, yield improvement, and production release for analog and power management ICs. Collaborate with systems, device, modeling, layout, EDA, and validation teams; guide physical design and floor planning; evaluate AC-DC and DC-DC architectures; support failure analysis; and mentor junior engineers.

Supports high-voltage SiC MOSFET testing and characterization, power electronics schematic and PCB design, evaluation board validation, laboratory measurements, and converter simulations using PLECS and SIMetrix. Develops technical documentation, supports field application engineers and customer enablement, and collaborates with R&D, marketing, quality, and operations teams. Requires an Electrical Engineering degree, hands-on high-voltage power electronics experience, and knowledge of semiconductor applications, isolation, gate drivers, and power converter topologies.

The Controller oversees accounting operations, financial close, SEC reporting, tax, inventory and cost accounting, controls, audits, and SOX compliance. The role supports financings, M&A, regulatory filings, technical accounting research, internal and external audits, and reporting process improvements. It requires strong US GAAP and SEC expertise, international entity and intercompany experience, active CPA certification, and extensive accounting leadership experience.

Leads semiconductor assembly process characterization, NPI risk assessment, process documentation, subcontractor coordination, tooling procurement, and production qualification through mass production release. Manages critical NPI builds, investigates quality and yield issues, supports customer-return resolution, and coordinates cross-functional and global teams. Requires semiconductor backend process engineering expertise, especially in wafer saw, laser groove, die bonding, wire bonding, or end-of-line assembly, plus proficiency with structured engineering problem-solving tools.

Manages outsourced semiconductor backend capacity across OSAT sites, including wafer bumping, CP testing, packaging, and final testing. Responsibilities include capacity modeling, equipment and manpower allocation, bottleneck removal, capacity forecasting, audits, NPI capacity design, OEE monitoring, and continuous improvement. The role coordinates with planning, R&D, sustaining, and OSAT teams to ensure stable production capacity and readiness for mass production.

Owns GaN power-device value propositions, product roadmaps, and system-level market strategy across Taiwan and China. Translates customer requirements into product and system solutions for performance computing, AI data centers, server PSUs, and related applications. Engages customers, distributors, sales, and engineering teams; supports design-ins through mass production; resolves issues; and develops technical collateral, whitepapers, presentations, and reference architectures. Requires extensive power-electronics product or applications marketing experience and frequent Asia travel.

Leads global development of high-voltage and ultra-high-voltage SiC power modules from architecture and prototyping through qualification, manufacturing ramp, and production release. Establishes packaging materials, assembly processes, reliability methods, testing, and manufacturing readiness. Oversees OSAT strategy, supplier qualification, yield and quality improvement, technical risk mitigation, and cross-functional execution while building and developing a multidisciplinary engineering organization.