Jobs at Navitas Semiconductor

Leads semiconductor assembly process characterization, NPI risk assessment, process documentation, subcontractor coordination, tooling procurement, and production qualification through mass production release. Manages critical NPI builds, investigates quality and yield issues, supports customer-return resolution, and coordinates cross-functional and global teams. Requires semiconductor backend process engineering expertise, especially in wafer saw, laser groove, die bonding, wire bonding, or end-of-line assembly, plus proficiency with structured engineering problem-solving tools.

Develops power system specifications, architectures, validation plans, and optimization strategies for semiconductor-based power conversion systems. Leads topology tradeoff analysis and collaborates across IC design, magnetics, packaging, thermal, firmware, and applications teams. Performs modeling, simulation, hardware validation, debugging, characterization, and customer deployment support. Creates technical documentation and supports FAEs, customer enablement, and cross-functional product development programs.

Design and develop high-voltage power electronics systems, including schematics, PCB layouts, digital controls, motor-control algorithms, gate-drive solutions, and semiconductor applications. Use MATLAB, Simulink, PLECS, and related tools for simulation and code generation. Perform high-voltage laboratory testing, debug hardware and software, create customer documentation, and support FAEs, sales, R&D, and customer programs.

Designs and characterizes power semiconductor systems from concept through production. Responsibilities include bench characterization, automated testing, high-voltage destructive testing, evaluation-board design, hardware development, customer product analysis, and FAE knowledgebase training. The role requires hands-on power electronics expertise, GaN FET and gate-driver knowledge, PCB design, simulation, LabVIEW automation, and high-voltage laboratory experience.

The FP&A Analyst builds operating expense models, manages forecasts and budgets, partners with department leaders, reviews general ledger activity, executes SOX controls, supports audits, and prepares executive reporting. The role also reconciles Business Central and Paycom data, improves reporting workflows, and translates financial results into actionable insights for leadership.

Manages outsourced semiconductor backend capacity across OSAT sites, including wafer bumping, CP testing, packaging, and final testing. Responsibilities include capacity modeling, equipment and manpower allocation, bottleneck removal, capacity forecasting, audits, NPI capacity design, OEE monitoring, and continuous improvement. The role coordinates with planning, R&D, sustaining, and OSAT teams to ensure stable production capacity and readiness for mass production.

Owns GaN power-device value propositions, product roadmaps, and system-level market strategy across Taiwan and China. Translates customer requirements into product and system solutions for performance computing, AI data centers, server PSUs, and related applications. Engages customers, distributors, sales, and engineering teams; supports design-ins through mass production; resolves issues; and develops technical collateral, whitepapers, presentations, and reference architectures. Requires extensive power-electronics product or applications marketing experience and frequent Asia travel.

Leads global development of high-voltage and ultra-high-voltage SiC power modules from architecture and prototyping through qualification, manufacturing ramp, and production release. Establishes packaging materials, assembly processes, reliability methods, testing, and manufacturing readiness. Oversees OSAT strategy, supplier qualification, yield and quality improvement, technical risk mitigation, and cross-functional execution while building and developing a multidisciplinary engineering organization.

Create and maintain bond shell, package outline, and single-unit drawings for semiconductor packages; produce 3D models for thermal/thermomechanical simulations; manage drawing directories, revisions, and weekly request status reports; collaborate with packaging engineers and global teams.

Lead GaN package design and development: define BOM/process flows and package layouts, perform risk assessments and simulations, run assembly validation and reliability qualification with OSAT, analyze yield and CPK, produce documentation and customer sample support, and lead cross-functional teams.

Lead company-wide operating expense forecasting, three-statement modeling, and the Annual Operating Plan. Partner with department budget owners, support investor relations and board materials, maintain SOX controls, and develop an international FP&A team while driving AI-driven automation and ERP data interoperability to improve forecast accuracy.

Manage semiconductor reliability lab operations including scheduling burn-in tests, hardware and inventory control, vendor coordination, SOPs, equipment maintenance, NPI hardware readiness, team tasking, and budget tracking to support device qualification and production support.

Plan and execute qualification and reliability testing for high-voltage GaN and SiC power devices to JEDEC/AEC standards. Track and report reliability metrics, perform FMEA and root-cause analysis, coordinate cross-functional qualification activities, manage external test vendors, operate bench instrumentation, and qualify suppliers to improve cost, quality, and lead time.

Develop, validate, and release wafer sort, final test, characterization, and module test solutions for SiC/GaN products. Create and debug test programs and hardware, execute electrical and dynamic testing across conditions, analyze test data for yield and reliability, support ATE/prober qualification and transfer, automate data collection and reporting, and support NPI and sustaining engineering activities.

Lead Pune test engineering team to develop, validate, and release wafer sort, final test, characterization, and module test solutions for SiC/GaN power semiconductors. Manage ATE, probers, handlers, test hardware, and supplier coordination; drive correlation, yield analysis, root-cause, automation, and production ramp support while ensuring safety, quality, and continuous improvement.

Own product change control and quality for SiC power semiconductor products across fab, test, assembly and manufacturing. Lead risk assessments, excursion responses (8D), root-cause analysis, yield improvement and cost-reduction projects. Maintain BOM/PLM data in Arena, implement statistical outlier methods (SPAT/DPAT/GDBN), and standardize processes across Torrance and Pune engineering sites.

Develop, validate, and maintain test programs and hardware for GaN/SiC devices. Execute electrical and dynamic testing across conditions, analyze manufacturing/test data, troubleshoot ATE and test hardware, support NPI and production ramps, and create automation and reporting tools.

Lead and execute GaN product engineering and NPI programs from concept to product release using APQP. Drive device characterization, qualification, reliability, test limit development, yield and sustaining engineering. Mentor teams, manage cross-functional risks, and deliver datasheets and release documentation for wide bandgap power device platforms.

Build and maintain automated yield, quality, and cost reporting; manage databases and dashboards; support PLM/BOM data entry, change control, and non-conformance documentation; track cost-reduction/yield projects; coordinate cross-site project schedules and prepare management presentations.

Lead technology transfer and manufacturing readiness for SiC/GaN products, drive yield and process-control improvements using statistical methods, support device reliability and failure analysis, manage foundry relationships, and build and mentor a device engineering team to ensure robust ramp into high-volume production.