The Role
Leads semiconductor assembly process characterization, NPI risk assessment, process documentation, subcontractor coordination, tooling procurement, and production qualification through mass production release. Manages critical NPI builds, investigates quality and yield issues, supports customer-return resolution, and coordinates cross-functional and global teams. Requires semiconductor backend process engineering expertise, especially in wafer saw, laser groove, die bonding, wire bonding, or end-of-line assembly, plus proficiency with structured engineering problem-solving tools.
Summary Generated by Built In
Key Responsibilities and Duties:
- Work with subcontractors on Assembly Processes Characterization. Risk base review on New Product/Package Introduced and create evaluation based on the risk identified. Will follow thru execution and closure.
- Review or generate Process specs and other documents, follow up review and approval by different teams within the organization.
- Work with Subcontractors in designing and improving leadframe, BOM.
- Work with Subcontractors on NRE tooling quote, PO release and delivery.
- Manage and prevent risks in running NPI products in assembly, closely monitor and on-site follow up on critical NPI builds.
- Support investigation and resolution of quality, yield and customer return issue. Daily sustaining to smooth the normal production.
- Regular online meeting with cross functional team (NPI, Delivery, Quality and Customer related).
- Lead overall execution locally at Subcon side together with global team.
- Use Project management tool is an advantage to manage NPI activities in subcon from process characterization to assembling Qualification lots to Mass Production Release.
Required Qualifications
Basic
- Bachelor degree or above in Mechanical Automation, Materials Science, Electrical Engineering, or related majors.
- Must be fluent in English in writing and speaking.
- Must have at least 5 years process engineering experience in a Semiconductor backend facility.
- Experienced with Wafer Saw, Laser Groove or DB or WB or EOL Assy. Advantage to have average understanding in the whole Assembly Process.
- Experienced with Engineering Problem Solving Tool like FMEA, SPC, Control plan, OCAP, 8D, MSA. Advantage on expert user on DOE.
Preferred
- Experienced in the whole Assembly Process (from Dicing to Singulation & Tape and Reel)
Skills Required
- Bachelor’s degree or higher in Mechanical Automation, Materials Science, Electrical Engineering, or a related field
- Fluent English writing and speaking skills
- At least 5 years of process engineering experience in a semiconductor backend facility
- Experience with wafer saw, laser groove, die bonding, wire bonding, or end-of-line assembly
- Experience with FMEA, SPC, control plans, OCAP, 8D, and MSA
- Expertise using DOE
- Experience across the full assembly process from dicing through singulation and tape and reel
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The Company
