Teams at Navitas Semiconductor

Leads semiconductor assembly process characterization, NPI risk assessment, process documentation, subcontractor coordination, tooling procurement, and production qualification through mass production release. Manages critical NPI builds, investigates quality and yield issues, supports customer-return resolution, and coordinates cross-functional and global teams. Requires semiconductor backend process engineering expertise, especially in wafer saw, laser groove, die bonding, wire bonding, or end-of-line assembly, plus proficiency with structured engineering problem-solving tools.

Develops power system specifications, architectures, validation plans, and optimization strategies for semiconductor-based power conversion systems. Leads topology tradeoff analysis and collaborates across IC design, magnetics, packaging, thermal, firmware, and applications teams. Performs modeling, simulation, hardware validation, debugging, characterization, and customer deployment support. Creates technical documentation and supports FAEs, customer enablement, and cross-functional product development programs.

Design and develop high-voltage power electronics systems, including schematics, PCB layouts, digital controls, motor-control algorithms, gate-drive solutions, and semiconductor applications. Use MATLAB, Simulink, PLECS, and related tools for simulation and code generation. Perform high-voltage laboratory testing, debug hardware and software, create customer documentation, and support FAEs, sales, R&D, and customer programs.