Jobs at Lumilens

Lead global sourcing for foundry and OSAT partners: develop supplier strategy, secure wafer/assembly/test capacity, run RFQs and should-cost analysis, negotiate contracts/MSAs, resolve commercial and delivery issues, and align sourcing with engineering and product roadmaps.

Design and optimize high-speed silicon photonic devices and PICs (modulators, photodetectors, passive components). Perform multi-domain simulations (EM, circuit, thermal) to meet 200G/lane+ targets. Implement PIC layouts (GDS) using foundry PDKs and support tapeouts. Co-design with electronics and packaging for RF, parasitics, signal integrity, and thermal constraints. Support silicon bring-up, characterize devices, correlate measurement with simulation, drive design iterations, and contribute to design libraries and methodology.

Lead strategic sourcing for silicon photonics, packaging, and optical components. Build supplier strategy, negotiate contracts, manage supplier performance, ensure supply continuity, support NPI-to-HVM transitions, and drive cost and risk reduction across cross-functional teams.

Lead reliability and qualification for photonic components (silicon photonics, lasers, SiPs). Define and execute Telcordia/JEDEC-aligned qualification plans, perform ALT, failure analysis, degradation modeling, and supplier qualification. Collaborate across R&D, packaging, manufacturing, and supply chain to enable NPI and transfer to volume production, and document reliability reports and risk assessments.

Lead full-chip and block-level physical implementation for advanced-node ASICs (5nm/3nm), owning floorplanning, placement, CTS, routing, signoff, and power/timing closure while collaborating with RTL, STA, IP, and verification teams to resolve high-speed transceiver implementation challenges.

The Silicon Photonics Engineer will develop high-performance photonic devices, enhance manufacturing processes, and collaborate with teams for production scaling.

Lead process development for III-V etching, coating, and related fabrication modules; translate product requirements into process specs and control plans; define tooling and metrology; design and run DOEs to optimize yield and manufacturability; qualify vendors and tools; document and institutionalize processes; collaborate with device, packaging, manufacturing, and external fabs to troubleshoot and scale.

Lead HR operations for the Thailand team, coordinating recruiting, onboarding, employee support, and office administration. Build scalable processes, create 30/60/90 day onboarding plans, partner with HR, IT, and managers, and serve as local HR point of contact while improving recruiting efficiency and candidate experience.

Responsible for SI/PI design of 1.6T OSFP modules, conducting simulations and validations, defining design constraints, collaborating with teams, debugging, and contributing technical documentation.

The Power Integrity Engineer will optimize power distribution networks for OSFP designs, performing simulations and collaborating with teams to ensure low-noise power delivery and mitigate interference in high-speed modules.

The Failure Analysis Engineer investigates optical, electrical, and mechanical failures in transceivers, collaborates with teams on root cause analysis, and develops testing infrastructure.

The role involves driving reliability execution for photonic components, collaborating with cross-functional teams, executing qualification plans, and conducting reliability testing and analysis.

Lead high-speed electrical design for 1.6T OSFP modules, oversee SI/PI architecture, conduct simulations, mentor engineers, and drive cross-functional decisions.

The Failure Analysis Engineer investigates failures of optical transceivers, troubleshooting using schematics and test equipment, documenting results, and collaborating with cross-functional teams to improve product reliability.

Design and implement front-end digital RTL blocks (SystemVerilog) including high-speed datapath, UCIe adapters, FIFOs, and assertions. Develop micro-architecture, write block-level testbenches, ensure lint/CDC/timing cleanliness, collaborate with DV/backend, and support simulation, emulation/FPGA bring-up and silicon debug.

The Director of Silicon Test Engineering will lead test strategy and execution for silicon photonics products, optimizing test solutions and ensuring product reliability. Responsibilities include managing ATE test development, driving yield optimization, and collaborating with cross-functional teams while building a high-performing engineering team.

The role involves designing and optimizing advanced packaging solutions for ASICs, conducting FEA simulations, and collaborating with cross-functional teams to enhance photonics technologies for AI and high-performance computing.

As an IC Package FEA Engineer, you will conduct FEA simulations for advanced packaging solutions, optimize designs, and collaborate with cross-functional teams to enhance reliability and performance in photonic devices.

Lead software integration for high-speed optical transceivers on advanced switch architectures, ensuring automation and system debugging, collaborating with cross-functional teams.

The Failure Analysis Engineer leads investigations of optical, electrical, and mechanical failures, communicating insights to influence product design and improve manufacturing processes.