Jobs at Lumilens

Lead development and support of flip chip assembly for silicon photonic wafers. Design and execute DOE, qualify materials, drive reliability validations, root-cause failure analysis, implement SPC and control plans, and produce SOPs/WIs to support NPI and long-term process stability.

Develop, qualify, and deploy manufacturing processes for optical transceivers (die attach, wire bond, active alignment, assembly) through high-volume production. Own process documentation, change control, equipment selection and introduction, SPC and yield analysis, failure analysis, and automation. Collaborate with suppliers, contract manufacturers, design, and quality teams; support qualification and reliability testing. International travel required.

Lead development and optimization of optical active alignment processes for transceiver production. Operate, qualify, and maintain alignment equipment; develop and improve alignment algorithms; manage epoxy dispensing/curing and fixture design; perform equipment buyoff; collaborate with R&D and manufacturing to improve yield, troubleshoot equipment and processes, and maintain process documentation for continuous improvement.

Develop and execute test solutions across characterization, wafer sort, and final test for silicon photonics and semiconductor products. Build ATE test programs (Advantest/Teradyne), optimize test flows for coverage/time/cost, analyze yield data, debug failures, and collaborate with design, product, and operations to enable NPI and high-volume manufacturing.

Lead strategic sourcing for silicon photonics, packaging, and optical components. Build supplier strategy, negotiate contracts, manage supplier performance, ensure supply continuity, support NPI-to-HVM transitions, and drive cost and risk reduction across cross-functional teams.

Lead reliability and qualification for photonic components (silicon photonics, lasers, SiPs). Define and execute Telcordia/JEDEC-aligned qualification plans, perform ALT, failure analysis, degradation modeling, and supplier qualification. Collaborate across R&D, packaging, manufacturing, and supply chain to enable NPI and transfer to volume production, and document reliability reports and risk assessments.

Lead full-chip and block-level physical implementation for advanced-node ASICs (5nm/3nm), owning floorplanning, placement, CTS, routing, signoff, and power/timing closure while collaborating with RTL, STA, IP, and verification teams to resolve high-speed transceiver implementation challenges.

Lead material and supply planning for new product introductions from prototype through pilot and design qualification. Translate engineering build plans into material and procurement plans, ensure BOM and component readiness, identify long-lead and single-source risks, track equipment procurement, align materials with CM partners, support ECO-driven plan updates, and deliver planning analytics and supply readiness reporting to cross-functional leadership.

Lead sourcing and end-to-end supply chain for optical/photonics components. Own supplier identification, qualification, negotiations, capacity planning, risk mitigation, dual-source strategies, and cross-functional alignment. Track supplier performance, maintain supply roadmaps, and drive continuous improvement to meet prototype through production ramps.

Lead process development for III-V etching, coating, and related fabrication modules; translate product requirements into process specs and control plans; define tooling and metrology; design and run DOEs to optimize yield and manufacturability; qualify vendors and tools; document and institutionalize processes; collaborate with device, packaging, manufacturing, and external fabs to troubleshoot and scale.

The Silicon Photonics Engineer will develop high-performance photonic devices, enhance manufacturing processes, and collaborate with teams for production scaling.

Lead HR operations for the Thailand team, coordinating recruiting, onboarding, employee support, and office administration. Build scalable processes, create 30/60/90 day onboarding plans, partner with HR, IT, and managers, and serve as local HR point of contact while improving recruiting efficiency and candidate experience.

Responsible for SI/PI design of 1.6T OSFP modules, conducting simulations and validations, defining design constraints, collaborating with teams, debugging, and contributing technical documentation.

The Power Integrity Engineer will optimize power distribution networks for OSFP designs, performing simulations and collaborating with teams to ensure low-noise power delivery and mitigate interference in high-speed modules.

The Failure Analysis Engineer investigates optical, electrical, and mechanical failures in transceivers, collaborates with teams on root cause analysis, and develops testing infrastructure.

The role involves driving reliability execution for photonic components, collaborating with cross-functional teams, executing qualification plans, and conducting reliability testing and analysis.

Lead high-speed electrical design for 1.6T OSFP modules, oversee SI/PI architecture, conduct simulations, mentor engineers, and drive cross-functional decisions.

The Failure Analysis Engineer investigates failures of optical transceivers, troubleshooting using schematics and test equipment, documenting results, and collaborating with cross-functional teams to improve product reliability.

Design and implement front-end digital RTL blocks (SystemVerilog) including high-speed datapath, UCIe adapters, FIFOs, and assertions. Develop micro-architecture, write block-level testbenches, ensure lint/CDC/timing cleanliness, collaborate with DV/backend, and support simulation, emulation/FPGA bring-up and silicon debug.

Lead development of wafer-level opto-electrical test solutions for NPO/CPO products across NPI to volume production. Design and qualify test hardware and software, manage RFQ and vendor qualification, transfer testers to production, create process documentation and training, and provide ongoing engineering support to maintain yield, throughput, alignment stability, and reliability.