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Create a company profileTigo is the worldwide leader in flexible module level power electronics (MLPE) with innovative solutions that significantly enhance safety, increase energy production, and decrease operating costs of photovoltaic (PV) systems. Tigo’s TS4 platform maximizes the benefit of PV systems and provides customers with the most scalable, versatile, and reliable MLPE solution available. Tigo was founded in Silicon Valley in 2007 to accelerate the adoption of solar energy worldwide. Tigo systems operate on 7 continents and produce gigawatt hours of reliable, clean, affordable and safe solar energy daily. Tigo's global team is dedicated to making the best MLPE on earth so more people can enjoy the benefits of solar. Visit us at www.tigoenergy.com.
Tessolve offers a unique combination of pre-silicon and post-silicon expertise to provide an efficient turnkey solution for silicon bring-up, and spec to the product. With 3000+ employees worldwide, Tessolve provides a one-stop-shop solution with full-fledged hardware and software capabilities, including its advanced silicon and system testing labs. Tessolve offers a Turnkey ASIC Solution, from design to packaged parts. Tessolve’s design services include solutions on advanced process nodes with a healthy eco-system relationship with EDA, IP, and foundries. Our front-end design strengths integrated with the knowledge from the backend flow, allows Tessolve to catch design flaws ahead in the cycle, thus reducing expensive re-design costs, and risks. We actively invest in the R&D center of excellence initiatives such as 5G, mmWave, Silicon photonics, HSIO, HBM/HPI, system-level test, and others. Tessolve also offers end-to-end product design services in the embedded domain from concept to manufacturing under an ODM model with application expertise in Avionics, Automotive, Industrial and Medical segments. Tessolve’s Embedded Engineering services enable customers a faster time-to-market through deep domain expertise, innovative ideas, diverse embedded hardware & software services, and built-in infrastructure with world-class lab facilities. Tessolve’s clientele includes Tier 1 clients across multiple market segments, 7 of the top 10 semiconductor companies, start-ups, and government entities. We have a global presence with office locations in the United States, India, Singapore, Malaysia, Germany, United Kingdom, China, UK, Japan, Thailand, Philippines, and Test Labs in India, Singapore, Malaysia, Austin, San Jose.
Infinita Lab accelerates R&D by streamlining and managing material testing end-to-end. We help solve difficult engineering problems fast and at a lower cost. As a marketplace, we bring access to thousands of materials testing labs from metrology to material property and finished product testing. Popular tests are TEM, SIMS, Profilometry, XRF, Nondestructive Testing, Electrical Testing, Chemistry Analysis, Root Cause Analysis, Vibration Testing, Humidity Testing, Accelerated Aging, etc. Our clients come from Semiconductor, Advanced Materials, Batteries, Solar, Nanotechnology, Additive Manufacturing, Coatings, Adhesives, LED, Display, MEMS, etc., industries. Infinita Lab delivers hassle-free materials testing and analysis with, 1. Average 30% Cost Savings 2. 100% Confidentiality Guarantee 3. Free, No-obligation Consultation 4. 100% Customer Satisfaction
Arteris (Nasdaq: AIP) a leading provider of system IP for the acceleration of system-on-chip (SoC) development across today’s electronic systems. Vertical applications include automotive, communications, consumer electronics, enterprise computing, and industrial applications, leveraging horizontal technologies such as AI/ML, functional safety and reliability, and hardware/software integration. Arteris network-on-chip (NoC) interconnect IP and IP deployment technology enable higher product performance with lower power consumption and faster time to market, delivering better SoC economics so its customers can focus on dreaming up what comes next. Arteris is broadly used by market-leading customers, with over 600 systems-on-chip design starts, resulting in over 3 Billion chips shipped.
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