Top Engineering Jobs

Designs, develops, integrates, tests, and troubleshoots electrical systems for semiconductor manufacturing and test equipment. Responsibilities include power distribution, circuit analysis, component selection, schematics, wiring diagrams, bills of materials, design validation, risk assessments, engineering changes, and system integration. The role also applies AI-assisted and generative AI tools to engineering documentation, technical analysis, troubleshooting, and process improvement.

Lead silicon debug and product quality for HBM products, influencing design decisions and ensuring system stability across customer platforms. Drive continuous improvement through technical leadership and cross-functional collaboration.

Establish and improve semiconductor process conditions, equipment parameters, and process capabilities. The engineer will reduce production costs, manage process improvement projects, evaluate new equipment and materials, analyze abnormalities, and maintain quality and safety standards. The role also uses AI-enabled tools and data analytics to improve failure analysis, accelerate root-cause identification, and enhance reporting.

Sustain and optimize photomask BEOL manufacturing processes to improve quality, yield, reliability, and efficiency. Investigate process excursions, perform root cause analysis, implement corrective actions, collaborate with cross-functional engineering and manufacturing teams, and lead process characterization, qualification, technology transfer, and continuous improvement projects. Apply AI and generative AI tools to data analysis, documentation, troubleshooting, and process optimization with appropriate engineering validation.

Analyzes semiconductor probe yields, trends, defects, and manufacturing data to identify yield limiters and root causes. Uses statistical methods, data mining, and AI-enabled tools to prioritize issues, correlate electrical and physical data, and drive corrective actions with Process Integration, Process Engineering, and Failure Analysis teams. Develops automation, analytical methods, and best-known practices to deliver sustainable yield improvements across global manufacturing teams.

Integrate and implement engineering solutions to improve product performance. Collaborate with cross-functional teams to define project requirements and develop integration methodologies. Conduct testing and troubleshooting to ensure system functionality and performance, while preparing documentation and reports. The role requires engineering experience, strong problem-solving and communication skills, adherence to timelines, and a bachelor's or master's degree in engineering, computer science, or a related field. Semiconductor industry experience is preferred.

Develop and integrate advanced semiconductor packaging processes, materials, equipment, and technologies for new technology nodes. Lead process development, qualification, characterization, risk mitigation, yield improvement, and transition into production. Collaborate across frontend, backend, equipment, materials, and technology teams to resolve process issues, improve reliability and cost efficiency, and deliver packaging capabilities on schedule. Apply simulation, analytics, and AI tools to optimize performance and enable future packaging solutions.

Leads process integration for advanced packaging and HBM products from NPI through high-volume manufacturing. Owns cross-module integration across PWF, assembly, and test; defines characterization strategies, process windows, and yield improvements; resolves complex yield, reliability, and performance issues; and drives risk mitigation across sites. The engineer collaborates with Fab, Assembly, Test, Yield, Quality, and central engineering teams while providing data-driven technical leadership and implementing AI-enabled process improvements.

Leads firmware engineering teams responsible for analyzing, designing, programming, debugging, and optimizing embedded code for SSD and storage products. Oversees software interactions with analog and digital hardware, operating systems, ASICs, and SoCs. Manages firmware development using C, C++, and assembly, supports storage interfaces and flash translation technologies, estimates development work, troubleshoots performance issues, and develops engineering talent.

Develop, debug, and maintain Python and C/C++ test programs for high-bandwidth memory devices using automated test equipment. Lead test algorithm development, hardware validation, new product introduction, yield and quality analysis, test program releases, and root-cause resolution. Collaborate with global teams on pre- and post-silicon activities, production test optimization, equipment qualification, process improvements, and cost-of-test reduction while applying AI-enabled engineering tools.