Senior/Staff/Principal - Adv Pkg TD Integrator

Posted 20 Days Ago
Be an Early Applicant
Taichung City, TWN
In-Office
Senior level
Artificial Intelligence • Hardware • Information Technology • Machine Learning
Your talent powers our future.
The Role
Develop and integrate advanced semiconductor packaging processes, materials, equipment, and technologies for new technology nodes. Lead process development, qualification, characterization, risk mitigation, yield improvement, and transition into production. Collaborate across frontend, backend, equipment, materials, and technology teams to resolve process issues, improve reliability and cost efficiency, and deliver packaging capabilities on schedule. Apply simulation, analytics, and AI tools to optimize performance and enable future packaging solutions.
Summary Generated by Built In
Our vision is to transform how the world uses information to enrich life for all .
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
As part of APTD Technology Development Process Integrator, you will be responsible for developing advanced packaging process solution and ensure New Process, New Equipment, New Material and Path finding activities success for all adv pkg products in Micron.
To lead/contribute new Technode process readiness and improving the yield, quality and reliability with process characterization and optimization and new materials, machines & technologies introduction. Having understanding of Frontend Process is a plus, packaging requirements, chip package interaction, equipment understanding and process technology in the industry. The ability to enable best technology for New Technode with packaging requirements. You will also be required to drive & collaborate with cross functional teams to resolve process related problems.
Ensure smooth transition from new process development, 1st qualification success to small volume production launch
  • Development and Qualification of new packaging process, material, equipment and technology solutions to meet new Technode requirements and schedule
  • Perform CPI NUDD, process TRA, Si characterization, risk mitigation execution and process recipe readiness prior Silicon arrives and ensure 1st pass rate.
  • Qualify new process/technology/equipment/materials

Technical capability
  • Identify path finding opportunities for Micron's technology leadership with BIC time to market, continuous yield improvement, cost efficiency & touchpoint optimizations
  • To understand and be able to integrate process knowledge between upstream and downstream across Si and assembly/packaging process
  • Understand the future trend, technology and capabilities required for future packaging solutions, work with teams to put in place new capabilities to enhance integration
  • Provide new solutions on time to meet company and customer needs
  • To develop & engage creative solutions for new capabilities or to overcome the identified process constraints, ahead product requirements.

Job Requirements
  • PhD/Masters/Bachelor's Degree in Electrical & Electronic, Material, Mechanical Engineering, Physics & Applied Physics or Equivalent Work Experience Required
  • 5 years' and/or above experience in semiconductor industry
  • Experience in Frontend fab Process integration or Module process is a plus point
  • Experience in Backend advance packaging wafer/ die level process or integration
  • Understanding of silicon integration and how it interacts at backend process & package level through CPI
  • Proficiency with simulation tools and data analytics platforms for performance analysis and optimization
  • Experience in temporary/ permanent bonding technology (Wafer on wafer, Chip on wafer) is a plus
  • Strong project management skills to ensure execution to timelines
  • Strong communication and presentation skills
  • Ability to integrate & cooperate with people from cross function teams
  • Integrate artificial intelligence into daily task & leverage artificial intelligence/ agents for projects tasked

About Micron Technology, Inc.
We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities - from the data center to the intelligent edge and across the client and mobile user experience.
To learn more, please visit micron.com/careers
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.
To request assistance with the application process and/or for reasonable accommodations, please contact at [email protected] .
Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.
Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.

Skills Required

  • Bachelor’s, master’s, or PhD degree in electrical and electronic engineering, materials engineering, mechanical engineering, physics, applied physics, or equivalent work experience
  • Five or more years of experience in the semiconductor industry
  • Experience with backend advanced packaging wafer-level or die-level processes and integration
  • Understanding of silicon integration and chip-package interaction through CPI
  • Proficiency with simulation tools and data analytics platforms for performance analysis and optimization
  • Experience in frontend fab process integration or module processes
  • Experience with temporary or permanent bonding technology, including wafer-to-wafer or chip-to-wafer bonding
  • Strong project management skills for execution to timelines
  • Strong communication and presentation skills
  • Ability to collaborate with cross-functional teams
  • Ability to integrate artificial intelligence and AI agents into daily work and projects
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The Company
HQ: Boise, ID
45,000 Employees
Year Founded: 1978

What We Do

We are a world leader in innovative memory solutions that transform how the world uses information to enrich life for all. For over 45 years, our company has been instrumental to the world’s most significant technology advancements, delivering optimal memory and storage systems for a broad range of applications.

Why Work With Us

Global opportunities, team member development, and career advancement—Micron invests in you and celebrates your skills, a growth mindset, and the tenacity to strive. At Micron, everyone innovates.

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Micron Technology Offices

Hybrid Workspace

Employees engage in a combination of remote and on-site work.

Micron recognizes the importance of maintaining a healthy work-life balance to foster a culture of collaboration, innovation and meet the needs of the business. In alignment with these values, we offer four flexible work arrangement options

Typical time on-site: Flexible
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