Top Engineering Jobs

Develops manufacturing software, scheduling automation, analytics, and decision-support reporting for semiconductor fab operations. Responsibilities include programming and debugging applications, analyzing production data, optimizing scheduling and equipment capacity, improving cycle time, eliminating waste, documenting systems, and coordinating continuous-improvement projects. The role partners with management and users to define requirements, deliver production applications, and ensure safety and regulatory compliance.

Design and develop IC package layouts for memory, storage, and ASIC products. Responsibilities include substrate and PCB layout, library and footprint creation, design verification, documentation, DRC, manufacturability validation, and collaboration with cross-functional engineering teams. The role also supports design automation and AI-enabled, data-driven engineering workflows. It is intended for recent graduates with engineering degrees and offers hands-on experience in semiconductor package design.

Designs, develops, integrates, tests, and troubleshoots electrical systems for semiconductor manufacturing and test equipment. Responsibilities include power distribution, circuit analysis, component selection, schematics, wiring diagrams, bills of materials, design validation, risk assessments, engineering changes, and system integration. The role also applies AI-assisted and generative AI tools to engineering documentation, technical analysis, troubleshooting, and process improvement.

Lead silicon debug and product quality for HBM products, influencing design decisions and ensuring system stability across customer platforms. Drive continuous improvement through technical leadership and cross-functional collaboration.

Establish and improve semiconductor process conditions, equipment parameters, and process capabilities. The engineer will reduce production costs, manage process improvement projects, evaluate new equipment and materials, analyze abnormalities, and maintain quality and safety standards. The role also uses AI-enabled tools and data analytics to improve failure analysis, accelerate root-cause identification, and enhance reporting.

Sustain and optimize photomask BEOL manufacturing processes to improve quality, yield, reliability, and efficiency. Investigate process excursions, perform root cause analysis, implement corrective actions, collaborate with cross-functional engineering and manufacturing teams, and lead process characterization, qualification, technology transfer, and continuous improvement projects. Apply AI and generative AI tools to data analysis, documentation, troubleshooting, and process optimization with appropriate engineering validation.

Analyzes semiconductor probe yields, trends, defects, and manufacturing data to identify yield limiters and root causes. Uses statistical methods, data mining, and AI-enabled tools to prioritize issues, correlate electrical and physical data, and drive corrective actions with Process Integration, Process Engineering, and Failure Analysis teams. Develops automation, analytical methods, and best-known practices to deliver sustainable yield improvements across global manufacturing teams.

Integrate and implement engineering solutions to improve product performance. Collaborate with cross-functional teams to define project requirements and develop integration methodologies. Conduct testing and troubleshooting to ensure system functionality and performance, while preparing documentation and reports. The role requires engineering experience, strong problem-solving and communication skills, adherence to timelines, and a bachelor's or master's degree in engineering, computer science, or a related field. Semiconductor industry experience is preferred.

Develop and integrate advanced semiconductor packaging processes, materials, equipment, and technologies for new technology nodes. Lead process development, qualification, characterization, risk mitigation, yield improvement, and transition into production. Collaborate across frontend, backend, equipment, materials, and technology teams to resolve process issues, improve reliability and cost efficiency, and deliver packaging capabilities on schedule. Apply simulation, analytics, and AI tools to optimize performance and enable future packaging solutions.

Leads process integration for advanced packaging and HBM products from NPI through high-volume manufacturing. Owns cross-module integration across PWF, assembly, and test; defines characterization strategies, process windows, and yield improvements; resolves complex yield, reliability, and performance issues; and drives risk mitigation across sites. The engineer collaborates with Fab, Assembly, Test, Yield, Quality, and central engineering teams while providing data-driven technical leadership and implementing AI-enabled process improvements.