Background
Driven by strong and growing demand for power semiconductor devices, particularly in AI-related applications, improving factory productivity has become an urgent priority.
We are seeking talented engineers who can contribute broadly as Device Engineering / Process Integration Engineers, supporting activities ranging from new technology development and new product introduction to yield/quality improvement of mass production products, process optimization, cost reduction, and troubleshooting.
Responsibilities
Roles & Responsibilities
In an 8-inch wafer fabrication facility, you will act as a technology owner for Analog IC processes, leveraging expertise in device engineering and process integration to drive development and manufacturing excellence.
- Lead and execute development and transfer projects for new technologies and new products
- Improve product quality and yield through process design and optimization from development through mass production
- Drive continuous improvement of quality, yield, and reliability for existing mass production products, contributing to technology robustness, cost reduction, and productivity enhancement
- Manage manufacturing conditions for production products (Control Plans, FMEA, SPC)
- Perform root cause analysis of issues and implement corrective actions based on risk management, including recurrence prevention (8D, FTA, Why-Why analysis, Risk Assessment, etc.)
Key Relationship
- Direct Report: Manager, Device Engineering Department
- Key Interfaces: Engineers and managers within Aizu Wafer Fab, Global Engineering Teams
Qualifications (Required)
- Bachelor’s degree or higher in engineering or a related field
- Experience in device engineering or process integration in a semiconductor wafer fabrication environment (Minimum ~5 years)
- Fundamental knowledge of IC processes, device physics, electrical characteristics/testing, analog IC circuits, and reliability
- Understanding of product specifications (SPEC) and design margin concepts
- Hands-on experience in data analysis (yield, electrical characteristics, defect/failure analysis) and strong problem-solving skills
- Practical experience in identifying root causes and implementing corrective actions for yield loss or performance issues
- Experience leading cross-functional projects involving manufacturing, process engineering, design/product development, quality, and backend operations
- Ability to communicate effectively in English (email and web meetings) with global teams and U.S. headquarters
- Business-level English proficiency (e.g., TOEIC score of ~600 or higher)
- Japanese language proficiency (equivalent to JLPT N2 level or above)
- Valid work authorization that permits employment in Japan at the time of application
- No visa sponsorship available for this position
Preferred Qualifications
- Experience as a technical lead or engineer in new technology development or technology transfer projects
- Experience in semiconductor circuit design, device simulation, or test development
- Knowledge and hands-on experience with semiconductor front-end processes and equipment
- Leadership experience in yield improvement or process optimization projects
- Ability to communicate effectively in technical discussions in English meetings
- Experience working in a multinational or global company environment is a plus
- Experience in driving process optimization and business improvement using AI technologies
Ideal Candidate Profile
- Continuously improves personal skills and can adapt to broader and deeper technical responsibilities
- Understands factory and departmental KPIs and is committed to achieving them
- Demonstrates strong ownership of products/technologies and drives problem-solving and improvements through to completion
- Able to identify root causes and solve problems logically and systematically
- Proactively identifies risks and implements preventive actions through risk assessment
- Effectively communicates and collaborates across teams, influencing and leading stakeholders
- Demonstrates flexibility and a positive attitude toward change and new technologies
- Possesses a customer-oriented mindset and understands on-site realities, making decisions based on overall optimization rather than partial optimization
More details about our company benefits can be found here:
https://www.onsemi.com/careers/career-benefits
Skills Required
- Bachelor's degree or higher in engineering or related field
- ~5 years experience in device engineering or process integration in a semiconductor wafer fabrication environment
- Fundamental knowledge of IC processes, device physics, electrical characteristics/testing, analog IC circuits, and reliability
- Understanding of product specifications (SPEC) and design margin concepts
- Hands-on experience in data analysis (yield, electrical characteristics, defect/failure analysis) and strong problem-solving skills
- Practical experience identifying root causes and implementing corrective actions for yield loss or performance issues
- Experience leading cross-functional projects (manufacturing, process, design/product development, quality, backend)
- Business-level English communication (email and web meetings) — e.g., TOEIC ~600 or higher
- Japanese language proficiency (equivalent to JLPT N2 level or above)
- Valid work authorization permitting employment in Japan at time of application
- No visa sponsorship available for this position
- Experience as technical lead or in new technology development/transfer projects
- Experience in semiconductor circuit design, device simulation, or test development
- Hands-on experience with semiconductor front-end processes and equipment
- Leadership experience in yield improvement or process optimization projects
- Experience working in multinational/global company environments
- Experience driving process optimization and business improvement using AI technologies
onsemi Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about onsemi and has not been reviewed or approved by onsemi.
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Retirement Support — Retirement programs are highlighted by a U.S. 401(k) with a 100% match on the first 4% and immediate vesting. International plans such as Ireland’s defined contribution scheme and Germany’s company-funded pension elements reinforce long-term savings.
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Leave & Time Off Breadth — Time-off policies include ten paid holidays, flexible vacation for exempt employees, and three to five weeks of vacation for non-exempt staff as tenure grows, alongside sick time accrual. Paid leaves span parental, bereavement, jury duty, and military service, with Europe locations offering additional statutory and seniority-based days.
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Parental & Family Support — Family supports include eight weeks of paid parental leave, company-sponsored backup care for children, adults, and pets, and up to $15,000 in adoption assistance. Regional provisions such as Switzerland’s child allowance and accessible EAP counseling show added attention to household needs.
onsemi Insights
What We Do
We are building a better future through intelligent technology. For over 60 years, onsemi and its ancestors have been leading the world’s greatest technology advancements. onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
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