Jobs at onsemi

Develop and maintain business-unit demand forecasts across customer, product, and market segments. Analyze demand patterns, forecast accuracy, risks, inventory KPIs, pricing, and opportunities. Collaborate with product line managers, Sales, operations, and business planning teams to drive allocation plans, resolve gaps, support executive demand reviews, and develop long-term strategic plans.

Leads global foundry sourcing strategy, executive supplier relationships, wafer pricing and capacity negotiations, technology access, commercial agreements, supplier performance, and risk reduction. Partners cross-functionally to align foundry capacity with product, technology, quality, manufacturing, and supply-chain roadmaps. Manages global teams and delivers cost savings, supply assurance, flexibility, and continuous improvement across semiconductor foundry partners.

Manufacturing Engineering Intern supporting semiconductor manufacturing projects focused on process optimization, yield improvement, productivity, continuous improvement, and operational efficiency. Responsibilities include analyzing manufacturing and equipment data, investigating root causes, developing dashboards and reports, supporting process qualifications and validations, documenting procedures, and collaborating with cross-functional teams. The intern may work on yield, OEE, cycle time, capacity, SPC, automation, cost reduction, and Industry 4.0 initiatives.

Leads regional Environmental, Health and Safety programs across manufacturing sites in Asia. Oversees regulatory compliance, ISO management systems, audits, risk assessments, incident investigations, emergency preparedness, environmental stewardship, KPI reporting, and continuous improvement. Provides technical guidance and leadership development to site EHS teams, supports customer and regulatory audits, drives corrective actions, and standardizes best practices across countries. Requires substantial travel throughout Asia and collaboration with senior leadership and multicultural teams.

Develops and optimizes semiconductor lithography manufacturing processes, including experiments, yield and reliability improvements, throughput optimization, cost reduction, SPC, DOE, and advanced data analysis. Supports production, resolves out-of-control conditions, manages non-conforming material, writes process specifications, and communicates procedures to operators and technicians. Requires hands-on experience with ASML or TEL equipment and MUV, DUV, and immersion lithography.

Performs reliability assessment and product qualification for GaN semiconductor technologies. Develops reliability test methodologies, qualification plans, accelerated stress tests, and reliability acceleration models. Analyzes reliability data, coordinates failure and root-cause investigations, prepares reports, and applies structured problem-solving methods. Collaborates with design, device engineering, technology development, and global reliability teams while managing multiple qualifications.

Perform semiconductor test program debugging, optimization, and revisions; analyze and improve device and product yield; manage non-conforming materials; revise process and product specifications; lead technicians in quality-control implementation; and collaborate with operations, business units, and fabrication engineering on yield improvements.

Leads strategy, commercialization, and growth for motor-control MCU platforms. Responsibilities include customer discovery, market sizing, competitive analysis, pricing, business cases, roadmap recommendations, product launches, sales enablement, design-win support, and cross-functional collaboration with engineering, software, applications, sales, operations, and marketing teams.

Define and commercialize MCU products by researching markets, customer needs, competitors, and application requirements. Develop product strategies, roadmaps, positioning, business cases, forecasts, and go-to-market plans. Lead customer and ecosystem engagement, support launches and sales enablement, influence cross-functional teams, and identify growth opportunities through product derivatives, partnerships, software, tools, and ecosystem investments.

Senior NPI Engineer responsible for transferring, qualifying, validating, and ramping new semiconductor products, packages, and technologies into manufacturing. The role drives cross-functional process integration, manufacturability, risk mitigation, material and equipment selection, troubleshooting, root-cause analysis, and improvements in yield, cost, quality, stability, and production volume. Requires expertise in semiconductor packaging and assembly processes, engineering tools, reliability, data analysis, and leading improvement projects.

Maintain semiconductor packaging equipment readiness through preventive maintenance, troubleshooting, upgrades, and tool support. Analyze technical charts, reduce equipment downtime, lead improvement projects, follow environmental health and safety requirements, collaborate with suppliers and technical teams, and guide others. The role requires sophisticated technical analysis, participation in projects, awareness of industry trends, and a bachelor’s degree with at least four years of experience.

Design and own power-module and silicon-interposer layouts from floorplan through tapeout. Perform DRC, LVS, parasitic extraction, stream-out, and database transfer, while reviewing layouts for electrical and physical correctness. Use KLayout, Cadence Virtuoso, and automation scripts, and collaborate with software and simulation engineers to define AI-assisted layout workflows, validation checks, and platform requirements.

Own and drive analog IC device/process integration in an 8-inch wafer fab: lead new technology/product development and transfer, optimize processes for yield, quality, and reliability, perform RCA and corrective actions, manage control plans/FMEA/SPC, and lead cross-functional improvement projects.

Manufacturing Engineering Intern supporting semiconductor factory process optimization, yield improvement, productivity, root cause investigations, data analysis, continuous improvement, equipment evaluations, process validation, and manufacturing performance reporting. The intern will collaborate with engineering, operations, quality, and maintenance teams while developing dashboards, documentation, and recommendations using manufacturing analytics and Lean principles.

Manufacturing Engineering Intern supporting semiconductor manufacturing projects involving process optimization, yield improvement, productivity, data analysis, root-cause investigations, continuous improvement, process documentation, equipment evaluations, and validation. The intern will develop reports and dashboards, analyze manufacturing performance metrics, collaborate with cross-functional teams, and present improvement recommendations to engineering and site leadership.

Conducts reliability and device testing, operates VPD-ICPMS equipment for cleanroom contamination detection, prepares ultra-pure chemicals, documents laboratory tools and capabilities, manages inventory, coordinates with lab teams, supports safety execution, and owns projects through completion while reporting results.

Leads architecture, design, qualification, and release of high-power SiC modules and related power semiconductor solutions. Owns engineering product development, technical risk assessment, design feasibility, and cross-functional execution. Leads global teams, drives DFMEA and PFMEA activities, uses ECAD and MCAD tools, and partners with customers to resolve technical challenges and support successful design-ins.

Operate and automate parametric test systems (Keithley B1500/B1505, HV-SMUs), develop ATE test programs and custom test hardware, support prototype validation, fabricate test setups, and provide hands-on lab support to cross-functional engineering teams.

Leads enterprise strategy, governance, and implementation of Agentic AI across semiconductor new product development. Builds AI-enabled design platforms, reusable engineering agents, knowledge repositories, and governance frameworks spanning analog, digital, verification, layout, testing, packaging, and systems engineering. Drives cross-functional transformation, establishes productivity and quality metrics, oversees AI lifecycle management, and delivers measurable improvements in development speed, engineering efficiency, IP reuse, and design quality.

Leads semiconductor design transfer programs, troubleshooting device behavior differences between manufacturing sites, assessing circuit and test impacts, supporting simulations and risk assessments, enabling foundry design environments, and modifying GDS files for tape-in and tape-out projects. Requires deep semiconductor design, device modeling, process design rule, chip architecture, yield improvement, failure analysis, and CAD layout expertise.