Jobs at onsemi

Lead global semiconductor capacity planning by collaborating with factories, technology development, industrial engineering, and finance teams. Responsibilities include managing tool roadmaps, maintaining equipment databases and master tool lists, evaluating tool retention or scrapping decisions, identifying capacity investments, and improving planning processes to mitigate supply constraints. The role requires strong stakeholder influence, analytical problem-solving, semiconductor supply chain experience, and collaboration with international teams.

Manage global probe and test capacity across onsemi factories and OSATs. Analyze demand, optimize resource allocation, support quarterly and annual planning, influence test-time improvements and platform migrations, assess factory performance, and develop equipment growth plans and business cases. The role also improves new-product capacity-planning processes and coordinates with supply chain, business units, engineering, and global manufacturing teams. Occasional travel is required.

Owns assigned semiconductor product portfolios and serves as the primary engineering contact across supply chain, manufacturing, sales, and customer support. Responsibilities include resolving customer returns, improving yield and quality, reducing costs, coordinating cross-functional investigations, and supporting manufacturing operations. The role requires expertise in power semiconductor devices, fabrication, assembly, testing, statistical analysis, and failure analysis.

Supports compensation reporting, data management, audits, system administration, recurring compensation processes, analyses, and process improvements across the Americas. Prepares and validates reports, maintains compensation systems, investigates data discrepancies, documents procedures, and presents findings to stakeholders. The role requires strong Excel, analytical, communication, organizational, and problem-solving skills, along with discretion when handling confidential employee information.

Provides strategic and generalist HR support to the East Fishkill site and business organizations. Partners with leadership on workforce development, performance management, employee relations, organizational change, compliance, audits, and HR programs. Uses workforce metrics and analytics to guide decisions, resolves sensitive employee issues, leads investigations, and drives process improvements. Builds relationships across global and regional HR teams, supports talent selection and development, and leads complex strategic initiatives in a manufacturing environment.

Owns manufacturing equipment reliability, uptime, availability, and OEE improvement. Leads complex troubleshooting, root-cause analysis, corrective actions, preventive and predictive maintenance, equipment qualification, upgrades, and reliability projects. Develops technical documentation, supports production-critical events, manages obsolescence and spare-parts risks, and coaches technicians. Collaborates across manufacturing, process, product, quality, facilities, and engineering teams to improve capacity, productivity, cost, and business continuity.

Develops and delivers global employee communications across digital channels, including SharePoint, newsletters, presentations, videos, and mobile platforms. Creates campaigns, leadership communications, culture initiatives, and employee stories while translating complex information into engaging messages. Manages intranet content, analyzes feedback and engagement metrics, supports internal events, and advises cross-functional stakeholders on consistent messaging.

Leads semiconductor process and device integration teams supporting BCD and image sensor platforms. Owns technology health, yield, process capability, device performance, reliability, manufacturing stability, and complex issue resolution. Partners cross-functionally to improve yield, cost, cycle time, quality, and manufacturability; leads excursions, root-cause investigations, corrective actions, and technology evaluations. Develops engineers through mentoring and communicates risks, priorities, and recovery plans to engineering and manufacturing leadership.

Provides confidential executive administrative support to an EVP and leadership team. Responsibilities include complex calendar management, domestic and international travel coordination, expense reporting, meeting planning, communications, records maintenance, Teams and SharePoint administration, vendor and office operations, IT equipment coordination, international shipment documentation, and process improvement. Requires strong organization, discretion, communication, prioritization, and multitasking skills in a fast-paced global environment.

Lead DFT strategy, architecture, test planning, and implementation for automotive, industrial, and consumer ASIC/SoC products. Manage and mentor DFT engineers; develop ATPG, BIST, scan insertion, and fault coverage strategies; collaborate with design, validation, manufacturing, and software teams; support post-silicon debug, yield improvement, and field failure analysis; ensure compliance with standards such as ISO 26262; and evaluate DFT tools and methodologies.

Conducts semiconductor device research involving top-drain TFET evaluation, TCAD and multiphysics modeling, atomistic simulations for NVM devices, electrical characterization, device tradeoff analysis, white paper development, and layout work for next-generation devices.

Manage semiconductor probe and test operations at Chinese subcontractors and provide on-site troubleshooting for production and project activities. Oversee lot dispositions, analyze and improve test yields, monitor backend testing, and manage subcontractor KPIs including cycle time and lot reject rate. Coordinate multinational teams and communicate results in English.

Leads semiconductor assembly New Product Introduction activities from development through high-volume manufacturing. Owns process definition, characterization, qualification, optimization, risk assessment, equipment readiness, and production ramp-up. Provides technical leadership across die attach, wire bonding, molding, singulation, and related assembly operations. Drives yield improvement, reliability testing, failure analysis, corrective actions, documentation, and change management. Collaborates with engineering, quality, suppliers, customers, and manufacturing teams to ensure product quality, cost, reliability, and production readiness.

Support and optimize high-volume semiconductor wafer bumping and DPS processes. Responsibilities include process development, characterization, yield improvement, defect reduction, equipment and material qualification, root cause and failure analysis, SPC implementation, manufacturing change management, customer qualification support, and continuous improvement. The engineer collaborates with cross-functional teams and suppliers, troubleshoots bump defects, analyzes process data, and trains manufacturing personnel.

Performs semiconductor device engineering and yield enhancement in a silicon wafer fabrication environment. Responsibilities include production yield improvement, new product introduction, technology transfers, scrap reduction, process optimization, defect reduction, data and test analysis, manufacturability improvements, and presenting KPIs to management. The role collaborates extensively with fab process engineering, technology development, failure analysis, design, testing, quality, and business teams.

Supports accounting operations across multiple entities and regions by maintaining financial records, preparing journal entries, reconciling accounts, investigating discrepancies, and assisting with financial close and audits. The role also supports compliance, internal controls, process improvements, automation, transitions, and finance projects while collaborating with international teams.

Lead external manufacturing NPI for semiconductor assembly and packaging, from concept through qualification, production launch, and ramp. Drive wafer-level packaging, bumping, plating, manufacturability, process characterization, risk mitigation, and OSAT readiness. Establish manufacturing strategies, package platforms, best practices, and production baselines while resolving yield and ramp issues. Collaborate across internal and external stakeholders, support audits and continuous improvement, and potentially lead technical team activities.

Leads process, quality, and operational improvement initiatives at external semiconductor subcontractors in Taiwan. Responsibilities include process robustness, change control, risk mitigation, root cause analysis, corrective actions, audits, yield enhancement, production support, and qualification activities. The role requires strong semiconductor packaging and assembly expertise, onsite subcontractor engagement, cross-functional collaboration, and leadership in automotive-grade manufacturing improvement.

Support the Protection & Signal Applications Team through applications testing for ESD and RF specifications, test bench setup, and laboratory activities. Collaborate with applications, design, product, and marketing teams while contributing to technical leadership for protection products. The intern will apply electrical hardware and software programming skills, use simulation tools, analyze results, and solve problems in a multidisciplinary semiconductor environment.

Drive development, qualification, and commercialization of new MOSFET products. Define specifications, validate electrical performance, develop test requirements, monitor qualification and reliability results, investigate failures, and lead corrective actions. The role collaborates with design, technology, test, reliability, quality, manufacturing, applications, and marketing teams to deliver robust, manufacturable, cost-effective products on schedule.