Jobs at SiTime

Leads customer quality engagements for semiconductor products, investigating complaints, coordinating failure analysis and corrective actions, managing customer claims, and submitting qualification, reliability, 8D, and failure analysis reports. Participates in customer visits and audits, addresses observations through root-cause analysis, and owns PPAP preparation and approval. Requires semiconductor manufacturing experience, quality methodologies, and knowledge of CMOS and MEMS devices.

Partners with finance and business leaders on budgeting, forecasting, close, variance analysis, P&L management, expense control, and resource allocation. Builds cost models, supports BOM and NPI estimates, develops scenario analyses, and delivers leadership-ready reporting. The role also improves reporting automation, standardizes processes, and translates complex financial data into actionable recommendations across Finance, Engineering, Operations, HR, Procurement, and IT.

Partners with business-unit Finance leaders on budgeting, forecasting, close, variance analysis, P&L management, expense control, and decision support. Builds scalable financial models, standard cost models, and management reporting while advising on resource allocation, sourcing, capacity, and pricing decisions. Collaborates across Engineering, Operations, Tax, Accounting, and other functions, improves reporting through automation and BI tools, and supports Canada GST/HST compliance.

Build and scale SiTime’s corporate communications programs across customer and partner storytelling, media relations, industry events, employee communications, and social amplification. Develop relationships with journalists, secure coverage and speaking opportunities, translate complex semiconductor technology into compelling narratives, and create measurable, repeatable workflows. Partner cross-functionally with Sales, Marketing, Product, Business Development, and Human Resources while managing stakeholders, deadlines, and sensitive information with limited oversight.

The Time Synchronization System Architect will develop technical relationships with key customers, drive architectural discussions, influence SiTime's roadmap, and advocate technical expertise for design wins in data centers and networking markets.

Leads electrical and physical failure analysis for semiconductor ICs, from fault isolation through root-cause determination. Investigates customer returns, qualification and reliability failures, and new product issues using advanced analytical tools. Collaborates with design, test, product, system, reliability, manufacturing, and customer engineering teams to drive corrective actions and improve product quality. Produces technical reports and leadership updates while strengthening failure-analysis practices and efficiency.

Leads custom analog and full-custom digital layout design for CMOS and BiCMOS circuits at chip, block, and cell levels. Responsibilities include floorplanning, routing, power distribution, shielding, device matching, DRC/LVS/ERC verification, chip integration, and tape-out. The role coordinates offshore designers, mentors junior engineers, develops layout methodologies, improves workflows, and resolves parasitic, signal integrity, electromigration, and power distribution challenges.

Develop and validate mixed-signal ASIC systems from device bring-up through production release. Design automated Python tests, characterize device performance, analyze requirements, debug hardware and communication issues, and support PCB design and rework. Collaborate with design, verification, and marketing teams, contribute to device drivers, collect datasheet data, document results, and diagnose analog, digital, timing, and high-speed signal behavior.

Leads the general ledger accounting function for a growing public company, overseeing monthly, quarterly, and annual close processes, journal entries, reconciliations, technical accounting, U.S. GAAP compliance, SOX controls, audits, and financial reporting. Manages AP, AR, and fixed-assets teams, remediates control deficiencies, and develops scalable accounting processes through automation and AI. Partners cross-functionally to improve accuracy, efficiency, and timely financial close.

Leads manufacturing finance for Operations and Supply Chain, including budgeting, forecasting, standard costing, inventory accounting, gross margin analysis, variance reporting, capital spending, controls, and audit readiness. Partners cross-functionally to connect operational performance with financial outcomes, improve processes and analytics, and develop finance team capabilities in a global semiconductor manufacturing environment.

Supports semiconductor production test solution development, validation, qualification, correlation, and release for ATE and oven-based trimming systems. Analyzes test and production data, monitors yield, troubleshoots hardware and software, investigates root causes, documents qualification results, and collaborates with manufacturing, OSATs, equipment teams, and cross-functional partners to improve test robustness and production performance.

The Principal Analog Mixed-Signal Engineer leads circuit design projects, develops device architectures, supervises design teams, and ensures compliance with technical specifications.

Serves as the primary HR partner for the Ottawa site, advising managers and employees on employee relations, performance management, talent development, engagement, organizational effectiveness, and workplace concerns. The role provides coaching, supports talent and organizational initiatives, implements HR programs and change efforts, and partners with global HR teams to strengthen culture and employee experience.

Leads customer quality and reliability engagements for semiconductor products. Coordinates complaint investigations with Failure Analysis and Product Engineering teams, communicates findings, manages claims, prepares qualification and reliability documentation, and supports customer audits and visits. Leads root-cause analysis, corrective actions, effectiveness verification, and PPAP execution. Requires semiconductor manufacturing knowledge, customer or supplier quality experience, and proficiency in structured problem-solving and quality-control methodologies.

Leads end-to-end product engineering for mixed-signal semiconductor timing products, from conception and NPI through qualification, manufacturing release, yield improvement, and end-of-life. Defines ATE test and manufacturing strategies, manages BOMs, supplier and customer excursions, and drives root-cause analysis, statistical yield optimization, product quality, and compliance. Partners with design, test, quality, operations, suppliers, and customers while mentoring engineers and influencing technical decisions.

Provides lifecycle support for semiconductor CAD and EDA environments across analog, digital, and mixed-signal CMOS design. Responsibilities include PDK management, tapeout flows, schematic and layout tools, simulation and verification environments, CAD automation, Linux support, tool evaluation, regression testing, documentation, user training, and EDA vendor coordination.

Provides lifecycle support for semiconductor CAD environments, PDKs, tapeout flows, analog, mixed-signal, and digital design tools. Develops automation scripts, regression flows, utilities, and documentation; evaluates and deploys new EDA software; supports Linux and design users; troubleshoots issues; and coordinates with EDA vendors across multiple engineering sites.

Designs, develops, qualifies, and releases custom semiconductor packaging technologies for MEMS-based timing products. Leads package design, development, production ramp, design-of-experiments, OSAT management, prototyping, testing, troubleshooting, and performance, reliability, and quality validation. The role works with leadframe, flip-chip, bumping, substrate-based, ceramic, wafer-level, and multi-chip packages while evaluating thermal, mechanical, electrical, stress, and material characteristics.

Leads the specification, design, development, qualification, and production release of custom semiconductor packaging for MEMS timing products. Responsibilities include developing packaging technologies, managing design of experiments, overseeing overseas OSAT activities, prototyping and testing package designs, ensuring performance and reliability requirements, and troubleshooting package issues. The role requires expertise in semiconductor packaging, flip-chip and bumping technologies, package modeling, materials characterization, and CAD tools.

Serves as a strategic finance partner by leading budgeting, forecasting, long-term planning, financial modeling, business case development, performance analysis, and executive reporting. Develops dashboards and actionable insights, evaluates capital investments, supports cost optimization, monitors financial risks, and ensures compliance with accounting standards and corporate policies. Collaborates with operations, supply chain, R&D, senior leadership, and internal audit to align financial performance with corporate strategy.