About SiTime
SiTime is the Precision Timing company.
Timing is the heartbeat of all electronics, ensuring performance, resilience and scalability. For decades, quartz devices, non-silicon technology, have kept systems in sync, but they struggle in harsher, more demanding environments. MEMS-based Precision Timing delivers greater accuracy, smaller size and resilience. Today, MEMS timing powers over 400 applications, including high-growth ones in AI datacenters, automated driving, industrial and humanoid robots, wearables and IoT.
Our semiconductor MEMS programmable solutions offer a rich feature set that enables customers to differentiate their products with higher performance, smaller size, lower power, and better reliability. With more than 4 billion devices shipped, SiTime is changing the timing industry. For more information, visit: www.sitime.com.
Job Summary
We are seeking a highly motivated and skilled Packaging Process Engineer to join SiTime in Thailand, focusing on QFN/LGA assembly technologies. In this role, you will be responsible for developing, optimizing, and sustaining advanced packaging processes to ensure high-quality and high-yield manufacturing. This is an excellent opportunity for a hands-on engineer to make a significant impact on cutting-edge semiconductor packaging technologies within a dynamic and innovative environment.
Responsibilities:
- Develop, optimize, and characterize packaging processes for QFN and LGA technologies, including wafer thinning, dicing and flip-chip bonding processes…
- Conduct process capability analysis (Cp/Cpk), implement statistical process control (SPC), and drive continuous improvement initiatives to enhance yield, quality, and cost-efficiency.
- Perform root cause analysis and implement corrective and preventive actions (8D methodology) for process-related issues and defects.
- Collaborate with R&D, design, equipment, and manufacturing teams to ensure seamless process transfer from development to high-volume manufacturing.
- Define and maintain process specifications, control plans, and standard operating procedures (SOPs).
- Evaluate and qualify new materials, equipment, and processes to support technology roadmaps and production requirements.
- Lead or participate in cross-functional teams for new product introduction (NPI) and process improvement projects.
- Provide technical support and training for manufacturing operators and technicians.
- Stay updated with the latest industry trends and advancements in packaging technologies.
- 60% OSATs onsite (in Bangkok/Ayutthaya), 10% travel (Asia/US).
Qualifications & Requirements:
- Bachelor, Master to PhD's degree in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, or a related discipline.
- Minimum of 5 years of experience in semiconductor packaging process engineering, specifically with strong knowledge of QFN/LGA and Flip-chip bonding technologies.
- In-depth understanding of packaging process flows, equipment, and materials (e.g., photoresists, polymers, solders, underfills).
- Proficiency in statistical analysis software (e.g., JMP, Minitab) and data interpretation.
- Experience with failure analysis techniques (e.g., SEM, EDX, Optical Microscopy, X-ray).
- Strong problem-solving skills and a data-driven approach to decision-making.
- Excellent communication, interpersonal, and teamwork skills.
- Ability to work independently and manage multiple projects simultaneously in a fast-paced environment.
- Fluency in English is required.
Compensation Range:
At SiTime, we believe great work deserves great rewards. We offer a comprehensive and highly competitive compensation package designed to attract top talent.
In addition to base salary, this role is eligible for a quarterly bonus tied to the achievement of innovation goals—reflecting our commitment to recognizing meaningful impact. We also offer equity grants, providing a meaningful opportunity to share in the company’s future growth and success.
SiTime is an Equal Opportunity Employer. We treat each person fairly and we do not tolerate discrimination or harassment against anyone on the basis of any protected characteristics, including race, color, religion, national or ethnic origin, sex, sexual orientation, gender identity or expression, age, disability, pregnancy, political affiliation, protected veteran status, protected genetic information, or marital status or other characteristics protected by law. SiTime participates in the E-Verify program.
Learn More about SiTime: Review the Get to Know SiTime section of our career page to explore our culture, values, and what makes us unique.
- Innovation on Top – Philosophies of Innovation with Rajesh Vashist
- Fabrication Knowledge – An Interview with Rajesh Vashist
- SiTime Corporation – YouTube
Skills Required
- Bachelor’s, master’s, or PhD degree in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, or a related discipline
- At least 5 years of semiconductor packaging process engineering experience
- Strong knowledge of QFN, LGA, and flip-chip bonding technologies
- In-depth understanding of packaging process flows, equipment, and materials, including photoresists, polymers, solders, and underfills
- Proficiency with statistical analysis software such as JMP or Minitab
- Experience with failure analysis techniques including SEM, EDX, optical microscopy, and X-ray
- Strong problem-solving skills and data-driven decision-making
- Excellent communication, interpersonal, and teamwork skills
- Ability to work independently and manage multiple projects in a fast-paced environment
- Fluency in English
SiTime Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about SiTime and has not been reviewed or approved by SiTime.
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Equity Value & Accessibility — Feedback suggests equity is a meaningful part of total compensation, with some highlighting the combination of salary, bonus, and stock as a strong point. Company materials emphasize employee equity as a core element of rewards.
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Wellbeing & Lifestyle Benefits — Feedback suggests on-site wellness amenities and daily conveniences (gym, snacks, beverages) support day-to-day wellbeing. The company highlights wellness programs alongside these lifestyle perks.
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Leave & Time Off Breadth — Feedback suggests paid vacation, holidays, sick leave, and volunteer time off are available, reinforcing recharge time. The company emphasizes work-life balance and encourages time to recharge.
SiTime Insights
What We Do
SiTime Corporation (Nasdaq: SITM), the market leader in silicon MEMS timing, is an analog and semiconductor company that is revolutionizing the timing market. Our broad portfolio of programmable solutions is available with ultra-fast lead times and offer a rich feature set that enables customers to differentiate their products with higher performance, smaller size, lower power, and better reliability.
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