Teams at SiTime

Lead transition of new MEMS-based semiconductor products to high-volume manufacturing. Develop and document manufacturing and test process flows, bring up OSAT, support early sampling and low-volume manufacturing, perform process capability and test data analysis, run initial failure analysis, report production capacity, and create RTP/documentation templates with cross-functional teams.

Lead specification, design, development, and qualification of custom semiconductor packaging (QFN, WLCSP, substrate, ceramic, multi-chip). Manage package design, DoEs, OSAT development/prototyping, ensure performance/reliability/quality, and lead troubleshooting and release-to-production activities.

Provide technical leadership and hands-on analog/mixed-signal CMOS circuit design for high-performance timing products. Design and develop PLLs, VCOs, phase detectors, and charge pumps; support prototyping, lab characterization, and post-layout verification; collaborate with cross-functional and remote teams; mentor junior designers and drive product development through production release.