Delos Data

United States
50 Total Employees
40 Product + Tech Employees
Year Founded: 2025

Jobs at Delos Data

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Recently posted jobs

5 Days AgoSaved
Hybrid
Palo Alto, CA, USA
Artificial Intelligence • Hardware • Semiconductor
As a System Software Engineer, you will design communication primitives for AI models, optimize performance for training workloads, and benchmark performance on clusters.
9 Days AgoSaved
Remote
USA
Artificial Intelligence • Hardware • Semiconductor
Delos is a stealth-mode startup seeking to build foundational technology for AI data centers, fostering a collaborative and responsible working environment.
9 Days AgoSaved
Remote
USA
Artificial Intelligence • Hardware • Semiconductor
Seeking an experienced DFT Verification Engineer to ensure ASIC DFT logic correctness, building robust verification environments, and collaborating with design engineers on high-quality silicon delivery.
9 Days AgoSaved
Hybrid
Montréal, QC, CAN
Artificial Intelligence • Hardware • Semiconductor
The System Software Engineer will design and implement communication and execution layers for AI models across GPUs, addressing performance issues in distributed training and inference tasks.
15 Days AgoSaved
Hybrid
2 Locations
Artificial Intelligence • Hardware • Semiconductor
The Software Development Engineer in Test will design and maintain an automated testing framework for AI systems, ensuring reliability and performance through extensive testing, debugging, and collaboration with system engineers.
19 Days AgoSaved
Hybrid
Palo Alto, CA, USA
Artificial Intelligence • Hardware • Semiconductor
Lead design, implementation, and lab validation of high-current power delivery systems for AI compute hardware. Responsibilities include schematic design, component selection, PDN placement and routing, VRM and transient testing, collaboration with SI/PI and package teams, and developing design guidelines and validation plans to ensure stable power under dynamic AI workloads.
24 Days AgoSaved
Hybrid
Palo Alto, CA, USA
Artificial Intelligence • Hardware • Semiconductor
Lead architecture and delivery of advanced multi-die IC packages for high-performance AI accelerators. Select package types, define substrate stack-ups, bump/ball maps, interposer and mechanical constraints. Design routing, signal escaping, and power distribution; collaborate with IC, SI/PI, physical design and board teams. Manage subcontractors and engage TSMC/OSAT, evaluate emerging packaging technologies, and support package bring-up, failure analysis, debug, and qualification.