Top Engineering Jobs

Support and optimize photo track semiconductor processes by establishing process conditions, setting equipment parameters, analyzing abnormalities, implementing improvements, and driving cost and capability upgrades to ensure efficient, safe production.

Lead wet-process (SWC, bench, scrub, backside, bevel) process and hardware improvements across global fabs. Drive productivity, yield, quality, cost, safety and sustainability through CIP development, supplier collaboration, IoT sensor deployments, tool qualification, and defect reduction projects. Develop roadmaps, acceptance criteria, and solutions for energy, water, and waste reduction while improving tool utilization and process capability.

The Principal/Senior Technician troubleshoots, repairs, and maintains electro-mechanical equipment, ensuring operational efficiency and safety compliance in a semiconductor manufacturing environment.

Lead the development of analog, mixed-signal, and digital blocks layout. Automate verification, ensure quality, and mentor engineers in layout fundamentals while collaborating across teams.

Support and optimize fab tool processing and capacity; analyze data and SPC to identify root causes and drive yield/cost improvements. Troubleshoot complex process/equipment issues, manage projects, coordinate change control and safety, and collaborate with shift teams, equipment engineers, and process integration to ensure consistent, high-volume production.

Lead development, qualification, and optimization of wafer-level bonding processes (hybrid, fusion, temporary). Drive yield, reliability, and cost improvements using DOE, FMEA, 8D, and SPC; qualify bonding equipment (EVG, TEL, Disco), introduce materials/spares, support technology transfer and ramp-up, troubleshoot manufacturing issues, and establish control plans and risk mitigation frameworks across global sites.

Lead the full-custom layout for complex analog/mixed-signal IP blocks, ensuring layout quality, conducting verification checks, and providing mentorship to junior engineers.

The PI Part Type Owner will coordinate new part introductions, manage wafer shipment logistics, identify yield issues, and ensure quality material delivery at Micron Technology.

The role involves defining ESD and latch-up strategies, ensuring product reliability, leading validation processes, and interfacing with design and manufacturing teams.

Lead technical authority in 3D NAND cell film development, overseeing multi-functional projects, technical strategy, mentorship, and advanced process development.